Simultaneously obtaining the Young's relaxation modulus and shear relaxation modulus of an epoxy molding compound by using DMA

Dao Long Chen, Tz Cheng Chiu, Tei Chen Chen, Ping Feng Yang, Chih Pin Hung, Jen Kuang Fang

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

In this work, a methodology is developed for obtaining the Young's relaxation modulus and shear relaxation modulus simultaneously by using a single dynamic mechanical analysis (DMA) experiment. The bulk modulus is assumed as a constant and calculated by Poisson's ratio. The modulating Young's moduli and characteristic times that measured by DMA are corrected analytically by using the developed formulas. The shear relaxation modulus is then obtained from the corrected modulating Young's moduli and the constant bulk modulus. As a demonstration of the methodology, it is applied to the DMA measurement of an epoxy molding compound (EMC).

Original languageEnglish
Title of host publicationProceedings of the 16th Electronics Packaging Technology Conference, EPTC 2014
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages171-174
Number of pages4
ISBN (Electronic)9781479969944
DOIs
Publication statusPublished - 2014 Jan 30
Event2014 16th IEEE Electronics Packaging Technology Conference, EPTC 2014 - Singapore, Singapore
Duration: 2014 Dec 32014 Dec 5

Publication series

NameProceedings of the 16th Electronics Packaging Technology Conference, EPTC 2014

Other

Other2014 16th IEEE Electronics Packaging Technology Conference, EPTC 2014
CountrySingapore
CitySingapore
Period14-12-0314-12-05

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering

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