SINTERING ADDITIVE AND MICROWAVE DIELECTRIC CERAMIC USING THE SAME

Hsing-I Hsiang (Inventor)

Research output: Patent

Abstract

一種低溫燒結助劑,將其添加於介電陶瓷粉末中,可於900℃的低溫燒結條件下,燒結出相對密度達90%以上以且相對介電常數εr(5GHz)為70至80,品質因子Qxf為2000至3000GHz以及溫度係數TCF約在20至60ppm/K左右之微波介電陶瓷。
Translated title of the contribution低溫燒結助劑與使用此燒結助劑之微波介電陶瓷
Original languageEnglish
Patent numberI377187
Publication statusPublished - 1800

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