Sintering behavior and interfacial analysis of Ni/Cu electrode with BaTiO3 particulates

Chih Lung Chen, Wen-Shi Lee, Wen Cheng Wei

Research output: Contribution to journalArticle

13 Citations (Scopus)

Abstract

The sintering behavior of Ni electrode alloyed with Cu and the interfacial structure between Ni/Cu to BaTiO3 (BT) have been investigated. The quantitative properties which include thermal shrinkage thermal expansion wetting behaviors of Ni/Cu alloys on BT sheet and composition distribution were measured by several thermal analysis techniques (TGA/DTA/TMA) and microstructural techniques (SEM/TEM/ HRTEM) with energy-dispersive spectroscopy (EDS). The shrinkage of the Ni/Cu/ BaTiO3 composite tested in 5%H2/N2 atmosphere showed strong influence by the addition of Cu and retarded slightly due to the addition of the BT particulates. The Cu alloyed with Ni improves the continuity of the electrode and does not trigger mutual reaction between Ni and BT.

Original languageEnglish
Pages (from-to)25-36
Number of pages12
JournalJournal of Electroceramics
Volume14
Issue number1
DOIs
Publication statusPublished - 2005 Jan 1

Fingerprint

shrinkage
particulates
sintering
thermal analysis
Sintering
Electrodes
electrodes
continuity
Differential thermal analysis
Thermoanalysis
wetting
Thermal expansion
Wetting
Energy dispersive spectroscopy
thermal expansion
actuators
Transmission electron microscopy
atmospheres
transmission electron microscopy
Scanning electron microscopy

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Ceramics and Composites
  • Condensed Matter Physics
  • Mechanics of Materials
  • Materials Chemistry
  • Electrical and Electronic Engineering

Cite this

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abstract = "The sintering behavior of Ni electrode alloyed with Cu and the interfacial structure between Ni/Cu to BaTiO3 (BT) have been investigated. The quantitative properties which include thermal shrinkage thermal expansion wetting behaviors of Ni/Cu alloys on BT sheet and composition distribution were measured by several thermal analysis techniques (TGA/DTA/TMA) and microstructural techniques (SEM/TEM/ HRTEM) with energy-dispersive spectroscopy (EDS). The shrinkage of the Ni/Cu/ BaTiO3 composite tested in 5{\%}H2/N2 atmosphere showed strong influence by the addition of Cu and retarded slightly due to the addition of the BT particulates. The Cu alloyed with Ni improves the continuity of the electrode and does not trigger mutual reaction between Ni and BT.",
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Sintering behavior and interfacial analysis of Ni/Cu electrode with BaTiO3 particulates. / Chen, Chih Lung; Lee, Wen-Shi; Wei, Wen Cheng.

In: Journal of Electroceramics, Vol. 14, No. 1, 01.01.2005, p. 25-36.

Research output: Contribution to journalArticle

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