Sintering Nano-Silver Paste by Resistive Joule Heating Process for 2G HTS Tape Joints

Chia Ming Yang, Yu Chuan Chang, Chi Lei Chang, In Gann Chen

Research output: Contribution to journalArticlepeer-review

Abstract

Developing a joining technology for 2G HTS tapes without significantly reducing their superconducting property is crucial for numerous applications (MRI, motor/generator, power trans-mission, etc.). In this study, low sintering temperature (~230C) nano-silver paste was used as solder to join two 2G HTS tapes. In addition, two heating methods, i.e., furnace heating (heat flux outside-in) and resistive Joule heating (heat flux inside-out), were studied. This study indicates that the heat flux from internal by resistive Joule heating method shows less deteriorating impact to the 2G RE-Ba-Cu-O tape (RE: rare earth element) during the sintering process with the best specific resistance of 0.074 µΩ·cm2 and Ic retention percentage of 99% (i.e., Ic reduced from 100 A before joining to 99 A after joining). This study indicates that nano-silver paste together with resistive Joule heating can possibly be used as soldering materials to join 2G HTS tapes.

Original languageEnglish
Article number1571
JournalMaterials
Volume15
Issue number4
DOIs
Publication statusPublished - 2022 Feb 1

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Condensed Matter Physics

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