Smoother substrate deposition designs and process emulations of DC magnetron sputters

Cheng Tsung Liu, Chih-Wen Chang, Chang Chou Hwang

Research output: Contribution to journalArticle

3 Citations (Scopus)

Abstract

To smooth the substrate depositions of DC magnetron sputter (MS), such that the supplementary electrical and mechanical adjustment efforts can be alleviated, a refinement scheme that can be applied directly to the existing DC MS will be introduced. By properly control the magnetic and electric fields inside the vacuum chamber, trajectories of those atoms that are sputtered from the target surface can be more spread out. In addition, with the resultant higher plasma density, chance of collisions among the sputtered atoms and those Ar ions in the plasma will also be increased, hence the resulting distributions of target atoms deposited on the substrate surface will certainly be even out. To further confirm such concepts, a rational emulating process that can exploring both the atom sputtering process from the target and those collisions at the chamber with different three-dimensional magnetic and electric field environments is also developed. Thus the associated performance investigations on the DC MS with different magnetron arrangements can then be conveniently explored.

Original languageEnglish
Article number6332554
Pages (from-to)4432-4435
Number of pages4
JournalIEEE Transactions on Magnetics
Volume48
Issue number11
DOIs
Publication statusPublished - 2012 Oct 29

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Atoms
Substrates
Electric fields
Magnetic fields
Plasma density
Sputtering
Trajectories
Vacuum
Ions
Plasmas

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

Cite this

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abstract = "To smooth the substrate depositions of DC magnetron sputter (MS), such that the supplementary electrical and mechanical adjustment efforts can be alleviated, a refinement scheme that can be applied directly to the existing DC MS will be introduced. By properly control the magnetic and electric fields inside the vacuum chamber, trajectories of those atoms that are sputtered from the target surface can be more spread out. In addition, with the resultant higher plasma density, chance of collisions among the sputtered atoms and those Ar ions in the plasma will also be increased, hence the resulting distributions of target atoms deposited on the substrate surface will certainly be even out. To further confirm such concepts, a rational emulating process that can exploring both the atom sputtering process from the target and those collisions at the chamber with different three-dimensional magnetic and electric field environments is also developed. Thus the associated performance investigations on the DC MS with different magnetron arrangements can then be conveniently explored.",
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Smoother substrate deposition designs and process emulations of DC magnetron sputters. / Liu, Cheng Tsung; Chang, Chih-Wen; Hwang, Chang Chou.

In: IEEE Transactions on Magnetics, Vol. 48, No. 11, 6332554, 29.10.2012, p. 4432-4435.

Research output: Contribution to journalArticle

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