Fingerprint
Dive into the research topics of 'Sn-3.0Ag-0.5Cu/Sn-58Bi composite solder joint assembled using a low-temperature reflow process for PoP technology'. Together they form a unique fingerprint.- Sort by
- Weight
- Alphabetically
Sn-3.0Ag-0.5Cu/Sn-58Bi composite solder joint assembled using a low-temperature reflow process for PoP technology
Yu An Shen, Shiqi Zhou, Jiahui Li, Chih han Yang, Sijie Huang, Shih kang Lin, Hiroshi Nishikawa
Research output: Contribution to journal › Article › peer-review
75
Citations
(Scopus)