Sn-3.0Ag-0.5Cu/Sn-58Bi composite solder joint assembled using a low-temperature reflow process for PoP technology

  • Yu An Shen
  • , Shiqi Zhou
  • , Jiahui Li
  • , Chih han Yang
  • , Sijie Huang
  • , Shih kang Lin
  • , Hiroshi Nishikawa

Research output: Contribution to journal › Article › peer-review

83 Citations (Scopus)

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