TY - GEN
T1 - Sn-based solder design using machine learning approach
AU - Liu, Yu Chen
AU - Yang, Chih Han
AU - Lin, Shih Kang
N1 - Funding Information:
ACKNOWLEDGMENT The authors gratefully acknowledge the financial supports from the Ministry of Science and Technology (MOST) in Taiwan (109-3111-8-006-001, 110-2636-E-006-016 and 110-2222-E-006-008). This work was also partially supported by the Hierarchical Green-Energy Materials (Hi-GEM) Research Center, from The Featured Areas Research Center Program within the framework of the Higher Education Sprout Project by the Ministry of Education (MOE) and MOST (110-2634-F-006-017) in Taiwan.
Publisher Copyright:
© 2022 Japan Institute of Electronics Packaging.
PY - 2022
Y1 - 2022
N2 - Sn-based solder is a typical material for electronic interconnections. Low-Ag-content Sn-based solder exhibits a low hardness and is promising for avoiding the drop-induced failure. However, Sn-based solder has a wide range of composition and thus modulating its hardness via experimental trial-and-error method is not economically feasible. In this study, we employed the machine learning approach to design low-hardness Sn-based solders. We successfully designed an alloy that showed a hardness value lower than pure Sn, which has the potential of having a high-resistance to drop-induced failure.
AB - Sn-based solder is a typical material for electronic interconnections. Low-Ag-content Sn-based solder exhibits a low hardness and is promising for avoiding the drop-induced failure. However, Sn-based solder has a wide range of composition and thus modulating its hardness via experimental trial-and-error method is not economically feasible. In this study, we employed the machine learning approach to design low-hardness Sn-based solders. We successfully designed an alloy that showed a hardness value lower than pure Sn, which has the potential of having a high-resistance to drop-induced failure.
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U2 - 10.23919/ICEP55381.2022.9795569
DO - 10.23919/ICEP55381.2022.9795569
M3 - Conference contribution
AN - SCOPUS:85133347800
T3 - 2022 International Conference on Electronics Packaging, ICEP 2022
SP - 43
EP - 44
BT - 2022 International Conference on Electronics Packaging, ICEP 2022
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 21st International Conference on Electronics Packaging, ICEP 2022
Y2 - 11 May 2022 through 14 May 2022
ER -