Sn-Zn-Al Pb-free solder - an inherent barrier solder for Cu contact

K. L. Lin; H. M. Hsu

doi:10.1007/s11664-001-0131-y

Sn-Zn-Al Pb-free solder - an inherent barrier solder for Cu contact

K. L. Lin, H. M. Hsu

Research output: Contribution to journal › Article › peer-review

49 Citations (Scopus)

Abstract

Flip chip solder bumps were produced on Cu contact applying Sn-9Zn-xAl Pb-free solder by dipping method. The solder bumps were tested under 85°C/85% RH (relative humidity) or at 150°C for 1000 hours to explore the shear strength and the interfacial interaction behavior. Experimental results revealed that Al and Zn, while not Sn, diffuse to the Cu/solder interface during the extended period test. A thin layer of Al_4.2Cu_3.2Zn_0.7 compound, characterized by XRD, was formed at the interface of the as-produced solder bump. This compound, which resulted from the gathering of Al at the interface, provides a barrier to Sn diffusion toward Cu substrate and, thus, no Cu-Sn compound was detected. This is the first time to find a Sn-containing solder which, in contact with Cu, does not form Cu-Sn intermetallic compound during heat treatment and, thus, the Sn-Zn-Al solder is termed an inherent barrier solder.

Original language	English
Pages (from-to)	1068-1072
Number of pages	5
Journal	Journal of Electronic Materials
Volume	30
Issue number	9
DOIs	https://doi.org/10.1007/s11664-001-0131-y
Publication status	Published - 2001 Sept

All Science Journal Classification (ASJC) codes

Electronic, Optical and Magnetic Materials
Condensed Matter Physics
Electrical and Electronic Engineering
Materials Chemistry

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10.1007/s11664-001-0131-y

Cite this

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title = "Sn-Zn-Al Pb-free solder - an inherent barrier solder for Cu contact",

abstract = "Flip chip solder bumps were produced on Cu contact applying Sn-9Zn-xAl Pb-free solder by dipping method. The solder bumps were tested under 85°C/85% RH (relative humidity) or at 150°C for 1000 hours to explore the shear strength and the interfacial interaction behavior. Experimental results revealed that Al and Zn, while not Sn, diffuse to the Cu/solder interface during the extended period test. A thin layer of Al4.2Cu3.2Zn0.7 compound, characterized by XRD, was formed at the interface of the as-produced solder bump. This compound, which resulted from the gathering of Al at the interface, provides a barrier to Sn diffusion toward Cu substrate and, thus, no Cu-Sn compound was detected. This is the first time to find a Sn-containing solder which, in contact with Cu, does not form Cu-Sn intermetallic compound during heat treatment and, thus, the Sn-Zn-Al solder is termed an inherent barrier solder.",

author = "Lin, {K. L.} and Hsu, {H. M.}",

note = "Funding Information: The financial support of this work from the National Science Council of Republic of China under NSC89-2216-E006-004 is gratefully acknowledged.",

year = "2001",

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doi = "10.1007/s11664-001-0131-y",

language = "English",

volume = "30",

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journal = "Journal of Electronic Materials",

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publisher = "Springer New York",

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T1 - Sn-Zn-Al Pb-free solder - an inherent barrier solder for Cu contact

AU - Lin, K. L.

AU - Hsu, H. M.

N1 - Funding Information: The financial support of this work from the National Science Council of Republic of China under NSC89-2216-E006-004 is gratefully acknowledged.

PY - 2001/9

Y1 - 2001/9

N2 - Flip chip solder bumps were produced on Cu contact applying Sn-9Zn-xAl Pb-free solder by dipping method. The solder bumps were tested under 85°C/85% RH (relative humidity) or at 150°C for 1000 hours to explore the shear strength and the interfacial interaction behavior. Experimental results revealed that Al and Zn, while not Sn, diffuse to the Cu/solder interface during the extended period test. A thin layer of Al4.2Cu3.2Zn0.7 compound, characterized by XRD, was formed at the interface of the as-produced solder bump. This compound, which resulted from the gathering of Al at the interface, provides a barrier to Sn diffusion toward Cu substrate and, thus, no Cu-Sn compound was detected. This is the first time to find a Sn-containing solder which, in contact with Cu, does not form Cu-Sn intermetallic compound during heat treatment and, thus, the Sn-Zn-Al solder is termed an inherent barrier solder.

AB - Flip chip solder bumps were produced on Cu contact applying Sn-9Zn-xAl Pb-free solder by dipping method. The solder bumps were tested under 85°C/85% RH (relative humidity) or at 150°C for 1000 hours to explore the shear strength and the interfacial interaction behavior. Experimental results revealed that Al and Zn, while not Sn, diffuse to the Cu/solder interface during the extended period test. A thin layer of Al4.2Cu3.2Zn0.7 compound, characterized by XRD, was formed at the interface of the as-produced solder bump. This compound, which resulted from the gathering of Al at the interface, provides a barrier to Sn diffusion toward Cu substrate and, thus, no Cu-Sn compound was detected. This is the first time to find a Sn-containing solder which, in contact with Cu, does not form Cu-Sn intermetallic compound during heat treatment and, thus, the Sn-Zn-Al solder is termed an inherent barrier solder.

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JO - Journal of Electronic Materials

JF - Journal of Electronic Materials

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ER -

Sn-Zn-Al Pb-free solder - an inherent barrier solder for Cu contact

Abstract

All Science Journal Classification (ASJC) codes

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