This study investigated the growth behavior of solder interconnect on solder bonding pad. The solder thickness was investigated with respect to parameters including bonding pad area, reflow temperature, solder paste volume, loading, and die size (metallization area). Solder thickness was found to have a maximum value with respect to the ratio of solder paste volume to pad size. Loading and the reflow temperature showed no effect on solder thickness. An enlargement in metallization area reduces the solder thickness, while greater solder paste volume increases the solder thickness.
|Number of pages||4|
|Journal||IEEE Transactions on Components and Packaging Technologies|
|Publication status||Published - 2000 Dec|
All Science Journal Classification (ASJC) codes
- Electronic, Optical and Magnetic Materials
- Electrical and Electronic Engineering