Solder thickness variation with respect to soldering parameters

Kwang Lung Lin; Steven Yao

doi:10.1109/6144.888850

Solder thickness variation with respect to soldering parameters

Kwang Lung Lin, Steven Yao

Research output: Contribution to journal › Article › peer-review

3 Citations (Scopus)

Abstract

This study investigated the growth behavior of solder interconnect on solder bonding pad. The solder thickness was investigated with respect to parameters including bonding pad area, reflow temperature, solder paste volume, loading, and die size (metallization area). Solder thickness was found to have a maximum value with respect to the ratio of solder paste volume to pad size. Loading and the reflow temperature showed no effect on solder thickness. An enlargement in metallization area reduces the solder thickness, while greater solder paste volume increases the solder thickness.

Original language	English
Pages (from-to)	661-664
Number of pages	4
Journal	IEEE Transactions on Components and Packaging Technologies
Volume	23
Issue number	4
DOIs	https://doi.org/10.1109/6144.888850
Publication status	Published - 2000 Dec

All Science Journal Classification (ASJC) codes

Electronic, Optical and Magnetic Materials
Electrical and Electronic Engineering

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10.1109/6144.888850

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title = "Solder thickness variation with respect to soldering parameters",

abstract = "This study investigated the growth behavior of solder interconnect on solder bonding pad. The solder thickness was investigated with respect to parameters including bonding pad area, reflow temperature, solder paste volume, loading, and die size (metallization area). Solder thickness was found to have a maximum value with respect to the ratio of solder paste volume to pad size. Loading and the reflow temperature showed no effect on solder thickness. An enlargement in metallization area reduces the solder thickness, while greater solder paste volume increases the solder thickness.",

author = "Lin, {Kwang Lung} and Steven Yao",

note = "Funding Information: Manuscript received July 30, 1999; revised June 25, 2000. This paper was recommended for publication by Associate Editor R. Chanchani upon evaluation of the reviewers{\textquoteright} comments. This work was supported by General Semiconductor Technology, Taiwan and the National Science Council of the Republic of China (NSC87-2216-E-006-027).",

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N1 - Funding Information: Manuscript received July 30, 1999; revised June 25, 2000. This paper was recommended for publication by Associate Editor R. Chanchani upon evaluation of the reviewers’ comments. This work was supported by General Semiconductor Technology, Taiwan and the National Science Council of the Republic of China (NSC87-2216-E-006-027).

PY - 2000/12

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N2 - This study investigated the growth behavior of solder interconnect on solder bonding pad. The solder thickness was investigated with respect to parameters including bonding pad area, reflow temperature, solder paste volume, loading, and die size (metallization area). Solder thickness was found to have a maximum value with respect to the ratio of solder paste volume to pad size. Loading and the reflow temperature showed no effect on solder thickness. An enlargement in metallization area reduces the solder thickness, while greater solder paste volume increases the solder thickness.

AB - This study investigated the growth behavior of solder interconnect on solder bonding pad. The solder thickness was investigated with respect to parameters including bonding pad area, reflow temperature, solder paste volume, loading, and die size (metallization area). Solder thickness was found to have a maximum value with respect to the ratio of solder paste volume to pad size. Loading and the reflow temperature showed no effect on solder thickness. An enlargement in metallization area reduces the solder thickness, while greater solder paste volume increases the solder thickness.

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Solder thickness variation with respect to soldering parameters

Abstract

All Science Journal Classification (ASJC) codes

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