Soldering of Ni-Cu-P deposits with In-Sn solders

Kwang-Lung Lin, Ch J. Chen

Research output: Contribution to journalArticle

3 Citations (Scopus)

Abstract

This work investigated the relative effectiveness of stearic acid, L- glutamic acid, and dimethylammonium chloride (DMAHCl) as the fluxes for the soldering of electroless Ni-Cu-P deposits with the In-Sn solders. The values of the wetting time, achieved with the wetting balance technique, indicated that the preference order of these flux alternatives in DMAHCl, L-glutamic acid, and then stearic acid. The possible interaction between the Cu of the Ni-Cu-P deposits and the In-Sn components resulted in a dewetting phenomenon short after an intial wetting occurrence as observed on the wetting balance experimental results. The wetting time was found to be inversely proportional to the solder bath temperature and the dipping speed of the sample.

Original languageEnglish
Pages (from-to)30-36
Number of pages7
JournalInternational Journal of Microcircuits and Electronic Packaging
Volume19
Issue number1
Publication statusPublished - 1996 Mar

Fingerprint

Soldering
Soldering alloys
Wetting
Deposits
Stearic acid
Glutamic Acid
Fluxes
Acids
Temperature
stearic acid

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering

Cite this

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Soldering of Ni-Cu-P deposits with In-Sn solders. / Lin, Kwang-Lung; Chen, Ch J.

In: International Journal of Microcircuits and Electronic Packaging, Vol. 19, No. 1, 03.1996, p. 30-36.

Research output: Contribution to journalArticle

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