Solution growth of Cu2S nanowalls on Cu substrates and their characterization

Yung Tang Nien, Yu Hsuan Chang, In Gann Chen

Research output: Contribution to journalArticlepeer-review

3 Citations (Scopus)

Abstract

A simple method of preparing Cu2S nanowalls was presented by immersing Cu substrates into a Na2S/HCl solution. X-ray diffraction (XRD) analysis revealed the formation of the monoclinic phase of Cu2S nanostructures on Cu substrates, presenting a thickness of less than 100 nm and a height of several micrometers (called nanowalls) from the scanning electron microscopic (SEM) images. Moreover, the transmission electron microscopy (TEM) and X-ray energy dispersive spectrometry (EDS) characterizations indicated that these Cu2S nanowalls were thinner near the sheet edge and had voids inside the sheets supposedly due to the etching reaction by Na2S/HCl. Cu substrates with Cu2S nanowalls were found to exhibit extinguished hydrophobicity (> 110°) resulting from their rough surfaces based on the water contact angle measurements. Electrical current-voltage analysis indicated the formation of a Schottky barrier at the Cu2S/Cu interface.

Original languageEnglish
Pages (from-to)1201-1203
Number of pages3
JournalMaterials Letters
Volume65
Issue number8
DOIs
Publication statusPublished - 2011 Apr 30

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

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