Spallation of interfacial Ag-Au-Cu-Zn compounds in Sn-Ag-Cu/Sn-Zn-Bi joints during 210 °C reflow

Po Cheng Shih, Kwang-Lung Lin

Research output: Contribution to journalArticle

7 Citations (Scopus)

Abstract

Sn-8Zn-3Bi solder paste was applied as a medium to joint Sn-3.2Ag-0.5Cu solder balls and Au/Ni/Cu metallized ball grid array substrates at 210 °C. The spallation behavior of Ag-Au-Cu-Zn compound was studied as the Sn-Ag-Cu/Sn-Zn-Bi joints were reflowed respectively for 5, 20 and 30 s. After reflow for 5 s, the cracks were formed between Ag-Au-Cu-Zn compounds and Ni metallization. With further reflow time of 20 s, the cracks were propagated. The crack formation and propagation between Ag-Au-Cu-Zn compounds and Ni metallization, and the instability of Ag-Au-Cu-Zn IMCs at Ni layer might lead to Ag-Au-Cu-Zn compound spallation as the molten solder might flow to the gap zones, exerting a lifting force to the Ag-Au-Cu-Zn compounds during soldering. As a result, the reasons for the crack formation were discussed.

Original languageEnglish
Pages (from-to)137-142
Number of pages6
JournalJournal of Alloys and Compounds
Volume439
Issue number1-2
DOIs
Publication statusPublished - 2007 Jul 31

Fingerprint

Soldering alloys
Metallizing
Crack initiation
Cracks
Ball grid arrays
Soldering
Ointments
Molten materials
Crack propagation
Substrates

All Science Journal Classification (ASJC) codes

  • Mechanics of Materials
  • Mechanical Engineering
  • Metals and Alloys
  • Materials Chemistry

Cite this

@article{f5e8765ede044c15878b2c2f18251c45,
title = "Spallation of interfacial Ag-Au-Cu-Zn compounds in Sn-Ag-Cu/Sn-Zn-Bi joints during 210 °C reflow",
abstract = "Sn-8Zn-3Bi solder paste was applied as a medium to joint Sn-3.2Ag-0.5Cu solder balls and Au/Ni/Cu metallized ball grid array substrates at 210 °C. The spallation behavior of Ag-Au-Cu-Zn compound was studied as the Sn-Ag-Cu/Sn-Zn-Bi joints were reflowed respectively for 5, 20 and 30 s. After reflow for 5 s, the cracks were formed between Ag-Au-Cu-Zn compounds and Ni metallization. With further reflow time of 20 s, the cracks were propagated. The crack formation and propagation between Ag-Au-Cu-Zn compounds and Ni metallization, and the instability of Ag-Au-Cu-Zn IMCs at Ni layer might lead to Ag-Au-Cu-Zn compound spallation as the molten solder might flow to the gap zones, exerting a lifting force to the Ag-Au-Cu-Zn compounds during soldering. As a result, the reasons for the crack formation were discussed.",
author = "Shih, {Po Cheng} and Kwang-Lung Lin",
year = "2007",
month = "7",
day = "31",
doi = "10.1016/j.jallcom.2006.08.260",
language = "English",
volume = "439",
pages = "137--142",
journal = "Journal of Alloys and Compounds",
issn = "0925-8388",
publisher = "Elsevier BV",
number = "1-2",

}

Spallation of interfacial Ag-Au-Cu-Zn compounds in Sn-Ag-Cu/Sn-Zn-Bi joints during 210 °C reflow. / Shih, Po Cheng; Lin, Kwang-Lung.

In: Journal of Alloys and Compounds, Vol. 439, No. 1-2, 31.07.2007, p. 137-142.

Research output: Contribution to journalArticle

TY - JOUR

T1 - Spallation of interfacial Ag-Au-Cu-Zn compounds in Sn-Ag-Cu/Sn-Zn-Bi joints during 210 °C reflow

AU - Shih, Po Cheng

AU - Lin, Kwang-Lung

PY - 2007/7/31

Y1 - 2007/7/31

N2 - Sn-8Zn-3Bi solder paste was applied as a medium to joint Sn-3.2Ag-0.5Cu solder balls and Au/Ni/Cu metallized ball grid array substrates at 210 °C. The spallation behavior of Ag-Au-Cu-Zn compound was studied as the Sn-Ag-Cu/Sn-Zn-Bi joints were reflowed respectively for 5, 20 and 30 s. After reflow for 5 s, the cracks were formed between Ag-Au-Cu-Zn compounds and Ni metallization. With further reflow time of 20 s, the cracks were propagated. The crack formation and propagation between Ag-Au-Cu-Zn compounds and Ni metallization, and the instability of Ag-Au-Cu-Zn IMCs at Ni layer might lead to Ag-Au-Cu-Zn compound spallation as the molten solder might flow to the gap zones, exerting a lifting force to the Ag-Au-Cu-Zn compounds during soldering. As a result, the reasons for the crack formation were discussed.

AB - Sn-8Zn-3Bi solder paste was applied as a medium to joint Sn-3.2Ag-0.5Cu solder balls and Au/Ni/Cu metallized ball grid array substrates at 210 °C. The spallation behavior of Ag-Au-Cu-Zn compound was studied as the Sn-Ag-Cu/Sn-Zn-Bi joints were reflowed respectively for 5, 20 and 30 s. After reflow for 5 s, the cracks were formed between Ag-Au-Cu-Zn compounds and Ni metallization. With further reflow time of 20 s, the cracks were propagated. The crack formation and propagation between Ag-Au-Cu-Zn compounds and Ni metallization, and the instability of Ag-Au-Cu-Zn IMCs at Ni layer might lead to Ag-Au-Cu-Zn compound spallation as the molten solder might flow to the gap zones, exerting a lifting force to the Ag-Au-Cu-Zn compounds during soldering. As a result, the reasons for the crack formation were discussed.

UR - http://www.scopus.com/inward/record.url?scp=34248578517&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=34248578517&partnerID=8YFLogxK

U2 - 10.1016/j.jallcom.2006.08.260

DO - 10.1016/j.jallcom.2006.08.260

M3 - Article

VL - 439

SP - 137

EP - 142

JO - Journal of Alloys and Compounds

JF - Journal of Alloys and Compounds

SN - 0925-8388

IS - 1-2

ER -