TY - JOUR
T1 - Specific heat capacities of Sn-Zn-based solders and Sn-Ag-Cu solders measured using differential scanning calorimetry
AU - Wu, Y. K.
AU - Lin, K. L.
AU - Salam, B.
N1 - Funding Information:
Financial support from the National Science Council of Republic of China (Taiwan) under NSC(94-2216-E-006-014) and the NCKU Project of Promoting Academic Excellence and Developing World Class Research Center (D96-2700) is gratefully acknowledged.
PY - 2009/2
Y1 - 2009/2
N2 - The specific heat capacities (C p) of Sn-Zn-based solders and Sn-Ag-Cu solders have been studied using differential scanning calorimetry. The procedure of measuring the specific heat capacity followed the standard test method designed by the American Society for Testing and Materials (ASTM) E1269-05. The results of this work are lists of specific heat capacities of Sn-9Zn, Sn-9Zn-xAg (x = 0.1, 0.5, 1, 2, and 3), Sn-9Zn-0.5Ag-yAl (y = 0.1, 0.2, and 0.5), Sn-9Zn-0.5Ag-yGa (y = 0.1, 0.2, and 0.5), Sn-8.5Zn-0.5Ag-0.01Al-0.1Ga, and Sn-zAg-0.5Cu (z = 1.0, 2.0, 3.0, and 3.5). The study also found that C p increased with increasing heating temperature. Furthermore, the lead-free solders investigated have a higher specific heat capacity than the traditional Sn-37Pb solder. Among the studied lead-free solders, Sn-3.5Ag-0.5Cu has the lowest C p and Sn-9Zn-0.1Ag has the highest C p. Increased silver content in the Sn-9Zn-xAg and Sn-xAg-0.5Cu solder alloys was also found to effectively lower their C p.
AB - The specific heat capacities (C p) of Sn-Zn-based solders and Sn-Ag-Cu solders have been studied using differential scanning calorimetry. The procedure of measuring the specific heat capacity followed the standard test method designed by the American Society for Testing and Materials (ASTM) E1269-05. The results of this work are lists of specific heat capacities of Sn-9Zn, Sn-9Zn-xAg (x = 0.1, 0.5, 1, 2, and 3), Sn-9Zn-0.5Ag-yAl (y = 0.1, 0.2, and 0.5), Sn-9Zn-0.5Ag-yGa (y = 0.1, 0.2, and 0.5), Sn-8.5Zn-0.5Ag-0.01Al-0.1Ga, and Sn-zAg-0.5Cu (z = 1.0, 2.0, 3.0, and 3.5). The study also found that C p increased with increasing heating temperature. Furthermore, the lead-free solders investigated have a higher specific heat capacity than the traditional Sn-37Pb solder. Among the studied lead-free solders, Sn-3.5Ag-0.5Cu has the lowest C p and Sn-9Zn-0.1Ag has the highest C p. Increased silver content in the Sn-9Zn-xAg and Sn-xAg-0.5Cu solder alloys was also found to effectively lower their C p.
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U2 - 10.1007/s11664-008-0589-y
DO - 10.1007/s11664-008-0589-y
M3 - Article
AN - SCOPUS:58349116008
SN - 0361-5235
VL - 38
SP - 227
EP - 230
JO - Journal of Electronic Materials
JF - Journal of Electronic Materials
IS - 2
ER -