Specific heat capacities of Sn-Zn-based solders and Sn-Ag-Cu solders measured using differential scanning calorimetry

Y. K. Wu, K. L. Lin, B. Salam

Research output: Contribution to journalArticle

26 Citations (Scopus)

Abstract

The specific heat capacities (C p) of Sn-Zn-based solders and Sn-Ag-Cu solders have been studied using differential scanning calorimetry. The procedure of measuring the specific heat capacity followed the standard test method designed by the American Society for Testing and Materials (ASTM) E1269-05. The results of this work are lists of specific heat capacities of Sn-9Zn, Sn-9Zn-xAg (x = 0.1, 0.5, 1, 2, and 3), Sn-9Zn-0.5Ag-yAl (y = 0.1, 0.2, and 0.5), Sn-9Zn-0.5Ag-yGa (y = 0.1, 0.2, and 0.5), Sn-8.5Zn-0.5Ag-0.01Al-0.1Ga, and Sn-zAg-0.5Cu (z = 1.0, 2.0, 3.0, and 3.5). The study also found that C p increased with increasing heating temperature. Furthermore, the lead-free solders investigated have a higher specific heat capacity than the traditional Sn-37Pb solder. Among the studied lead-free solders, Sn-3.5Ag-0.5Cu has the lowest C p and Sn-9Zn-0.1Ag has the highest C p. Increased silver content in the Sn-9Zn-xAg and Sn-xAg-0.5Cu solder alloys was also found to effectively lower their C p.

Original languageEnglish
Pages (from-to)227-230
Number of pages4
JournalJournal of Electronic Materials
Volume38
Issue number2
DOIs
Publication statusPublished - 2009 Feb 1

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Electrical and Electronic Engineering
  • Materials Chemistry

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