Speed Optimization of Vertically Stacked Gate-All-Around MOSFETs with Inner Spacers for Low Power and Ultra-Low Power Applications

Ya Chi Huang, Meng Hsueh Chiang, Shui Jinn Wang

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Citations (Scopus)

Abstract

This paper proposes vertically stacked gate-all-around MOSFET structure with optimized inner spacers to provide superior gate controllability and reduce additional parasitic capacitance simultaneously. To achieve better performance, we evaluate different inner spacer lengths while tuning source/drain doping profile to keep off-state leakage current unchanged. Considering the fabrication uniformity, the key of the conceptual process flow is to etch inner spacers selectively from top to bottom channel. The proposed approach can be applied to low power and ultra-low power design for SoC application without additional mask cost.

Original languageEnglish
Title of host publicationProceedings of the 20th International Symposium on Quality Electronic Design, ISQED 2019
PublisherIEEE Computer Society
Pages231-234
Number of pages4
ISBN (Electronic)9781728103921
DOIs
Publication statusPublished - 2019 Apr 23
Event20th International Symposium on Quality Electronic Design, ISQED 2019 - Santa Clara, United States
Duration: 2019 Mar 62019 Mar 7

Publication series

NameProceedings - International Symposium on Quality Electronic Design, ISQED
Volume2019-March
ISSN (Print)1948-3287
ISSN (Electronic)1948-3295

Conference

Conference20th International Symposium on Quality Electronic Design, ISQED 2019
Country/TerritoryUnited States
CitySanta Clara
Period19-03-0619-03-07

All Science Journal Classification (ASJC) codes

  • Hardware and Architecture
  • Electrical and Electronic Engineering
  • Safety, Risk, Reliability and Quality

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