Spot Mura evaluation in TFT-LCDs using automatic optical inspection

Fu Ming Tzu, Jung-Hua Chou

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

A quantitative automatic optical inspection (AOI) is developed to detect spot Mura in the green layer of the color filter for TFT-LCDs through the linear transmittance light engaged with digital imaging. It can detect a color range at 0.001 of CIE xyY, even lower than the just noticeable difference (JND). Further, a reflective spectrometer can identify the tendency of CIE y at the green layer, which is a convex profile for a thick film and concave profile for a thin film. The line scan photo sensor is capable of detection to 0.3 along with spot non-uniformity for the color difference of CIEDE 2000, and even lower.

Original languageEnglish
Title of host publicationInternational Microsystems Packaging Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference, Proceedings
DOIs
Publication statusPublished - 2010 Dec 1
Event2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference - Taipei, Taiwan
Duration: 2010 Oct 202010 Oct 22

Publication series

NameInternational Microsystems Packaging Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference, Proceedings

Other

Other2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference
CountryTaiwan
CityTaipei
Period10-10-2010-10-22

All Science Journal Classification (ASJC) codes

  • Hardware and Architecture
  • Electrical and Electronic Engineering

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    Tzu, F. M., & Chou, J-H. (2010). Spot Mura evaluation in TFT-LCDs using automatic optical inspection. In International Microsystems Packaging Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference, Proceedings [5699583] (International Microsystems Packaging Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference, Proceedings). https://doi.org/10.1109/IMPACT.2010.5699583