Static analysis of the die picking process

Yeong Jyh Lin; Sheng Jye Hwang

doi:10.1109/TEPM.2005.847396

Static analysis of the die picking process

Yeong Jyh Lin, Sheng Jye Hwang

Department of Mechanical Engineering

Research output: Contribution to journal › Article › peer-review

14 Citations (Scopus)

Abstract

A numerical procedure was applied to simulate the pickup process for a die bonder to study the breakage of GaAs dice. Parameters such as needle ejecting speed, vacuum pressure, and radius of needle were investigated by the Taguchi method to obtain the manufacture process working-window in order to shorten the tuning time. It was found that the ejecting speed of the needle and the downward pressing force of the pickup collet are the major factors for die breakage. This procedure could also be applied to inspecting the effects of other factors or analyzing different types of pickup machines.

Original language	English
Pages (from-to)	142-149
Number of pages	8
Journal	IEEE Transactions on Electronics Packaging Manufacturing
Volume	28
Issue number	2
DOIs	https://doi.org/10.1109/TEPM.2005.847396
Publication status	Published - 2005 Apr 1

All Science Journal Classification (ASJC) codes

Industrial and Manufacturing Engineering
Electrical and Electronic Engineering

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@article{18ab7f7cea584aebaea050f2e892ff4f,

title = "Static analysis of the die picking process",

abstract = "A numerical procedure was applied to simulate the pickup process for a die bonder to study the breakage of GaAs dice. Parameters such as needle ejecting speed, vacuum pressure, and radius of needle were investigated by the Taguchi method to obtain the manufacture process working-window in order to shorten the tuning time. It was found that the ejecting speed of the needle and the downward pressing force of the pickup collet are the major factors for die breakage. This procedure could also be applied to inspecting the effects of other factors or analyzing different types of pickup machines.",

author = "Lin, {Yeong Jyh} and Hwang, {Sheng Jye}",

year = "2005",

month = apr,

day = "1",

doi = "10.1109/TEPM.2005.847396",

language = "English",

volume = "28",

pages = "142--149",

journal = "IEEE Transactions on Electronics Packaging Manufacturing",

issn = "1521-334X",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

number = "2",

}

TY - JOUR

T1 - Static analysis of the die picking process

AU - Lin, Yeong Jyh

AU - Hwang, Sheng Jye

PY - 2005/4/1

Y1 - 2005/4/1

N2 - A numerical procedure was applied to simulate the pickup process for a die bonder to study the breakage of GaAs dice. Parameters such as needle ejecting speed, vacuum pressure, and radius of needle were investigated by the Taguchi method to obtain the manufacture process working-window in order to shorten the tuning time. It was found that the ejecting speed of the needle and the downward pressing force of the pickup collet are the major factors for die breakage. This procedure could also be applied to inspecting the effects of other factors or analyzing different types of pickup machines.

AB - A numerical procedure was applied to simulate the pickup process for a die bonder to study the breakage of GaAs dice. Parameters such as needle ejecting speed, vacuum pressure, and radius of needle were investigated by the Taguchi method to obtain the manufacture process working-window in order to shorten the tuning time. It was found that the ejecting speed of the needle and the downward pressing force of the pickup collet are the major factors for die breakage. This procedure could also be applied to inspecting the effects of other factors or analyzing different types of pickup machines.

UR - http://www.scopus.com/inward/record.url?scp=21244436074&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=21244436074&partnerID=8YFLogxK

U2 - 10.1109/TEPM.2005.847396

DO - 10.1109/TEPM.2005.847396

M3 - Article

AN - SCOPUS:21244436074

VL - 28

SP - 142

EP - 149

JO - IEEE Transactions on Electronics Packaging Manufacturing

JF - IEEE Transactions on Electronics Packaging Manufacturing

SN - 1521-334X

IS - 2

ER -