Strengthening in a copper composite containing graphene nanofillers

Y. Song, W. W. Liu, Y. Chen

Research output: Contribution to journalConference article

Abstract

Multi-layer graphenes (MLGs) reinforced Cu matrix composites were fabricated using spark plasma sintering in this research. Microstructure observation indicated that MLGs homogeneously disperse in the matrix to result in grain refinement. Instrumented spherical micro-indentation tests were conducted to evaluate micro-mechanical properties of the composites, and the elastic modulus and indentation yield strength of the 1.5 wt.% MLG/Cu composite increase up to ∼ 36% and ∼ 41% than those of the unreinforced Cu, respectively. Grain refinement, the enhanced dislocation density (EDD) due to the thermal expansion mismatch between Cu matrix and MLGs and Orowan are thought to be the main strengthening mechanisms in this research.

Original languageEnglish
Article number012017
JournalIOP Conference Series: Materials Science and Engineering
Volume170
Issue number1
DOIs
Publication statusPublished - 2017 Feb 17
Event3rd International Conference on Advanced Materials Research and Applications, AMRA 2016 - Guangzhou, China
Duration: 2016 Dec 182016 Dec 21

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Graphite
Strengthening (metal)
Graphene
Copper
Grain refinement
Indentation
Composite materials
Spark plasma sintering
Thermal expansion
Yield stress
Elastic moduli
Mechanical properties
Microstructure

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Engineering(all)

Cite this

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title = "Strengthening in a copper composite containing graphene nanofillers",
abstract = "Multi-layer graphenes (MLGs) reinforced Cu matrix composites were fabricated using spark plasma sintering in this research. Microstructure observation indicated that MLGs homogeneously disperse in the matrix to result in grain refinement. Instrumented spherical micro-indentation tests were conducted to evaluate micro-mechanical properties of the composites, and the elastic modulus and indentation yield strength of the 1.5 wt.{\%} MLG/Cu composite increase up to ∼ 36{\%} and ∼ 41{\%} than those of the unreinforced Cu, respectively. Grain refinement, the enhanced dislocation density (EDD) due to the thermal expansion mismatch between Cu matrix and MLGs and Orowan are thought to be the main strengthening mechanisms in this research.",
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Strengthening in a copper composite containing graphene nanofillers. / Song, Y.; Liu, W. W.; Chen, Y.

In: IOP Conference Series: Materials Science and Engineering, Vol. 170, No. 1, 012017, 17.02.2017.

Research output: Contribution to journalConference article

TY - JOUR

T1 - Strengthening in a copper composite containing graphene nanofillers

AU - Song, Y.

AU - Liu, W. W.

AU - Chen, Y.

PY - 2017/2/17

Y1 - 2017/2/17

N2 - Multi-layer graphenes (MLGs) reinforced Cu matrix composites were fabricated using spark plasma sintering in this research. Microstructure observation indicated that MLGs homogeneously disperse in the matrix to result in grain refinement. Instrumented spherical micro-indentation tests were conducted to evaluate micro-mechanical properties of the composites, and the elastic modulus and indentation yield strength of the 1.5 wt.% MLG/Cu composite increase up to ∼ 36% and ∼ 41% than those of the unreinforced Cu, respectively. Grain refinement, the enhanced dislocation density (EDD) due to the thermal expansion mismatch between Cu matrix and MLGs and Orowan are thought to be the main strengthening mechanisms in this research.

AB - Multi-layer graphenes (MLGs) reinforced Cu matrix composites were fabricated using spark plasma sintering in this research. Microstructure observation indicated that MLGs homogeneously disperse in the matrix to result in grain refinement. Instrumented spherical micro-indentation tests were conducted to evaluate micro-mechanical properties of the composites, and the elastic modulus and indentation yield strength of the 1.5 wt.% MLG/Cu composite increase up to ∼ 36% and ∼ 41% than those of the unreinforced Cu, respectively. Grain refinement, the enhanced dislocation density (EDD) due to the thermal expansion mismatch between Cu matrix and MLGs and Orowan are thought to be the main strengthening mechanisms in this research.

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