Stress and temperature analysis of the copper substrate indented with nanotubes and nanocones

Yun Che Wang, Jun Liang Chen, Ming Liang Liao, Chuan Chen, Yan Chi Chen, Chi Chuan Hwang

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

It has been shown that nanotubes and nanocones are most effective to make indents with large aspect ratios,. Detailed studies in the heat transfer processes under the nano-scale indentation, and the accompanying stress distributions are required much attention. In this study, the copper substrate was indented with a nanotube or nano-cone. It is found that nano-cones may make indents with larger aspect ratios than the nanotubes due to the local shell buckling. Time-domain heat transfer and stress analysis was carried out by using a control-volume technique with an atomic spatial resolution, except near the boundaries. The effect of temperatures and stresses on the changes of the microstructures of the substrate will be discussed.

Original languageEnglish
Title of host publicationProceedings of the ASME Micro/Nanoscale Heat and Mass Transfer International Conference 2009, MNHMT2009
Pages587-589
Number of pages3
DOIs
Publication statusPublished - 2010 Jul 12
EventASME 2009 Micro/Nanoscale Heat and Mass Transfer International Conference 2009, MNHMT2009 - Shanghai, China
Duration: 2009 Dec 182009 Dec 21

Publication series

NameProceedings of the ASME Micro/Nanoscale Heat and Mass Transfer International Conference 2009, MNHMT2009
Volume2

Other

OtherASME 2009 Micro/Nanoscale Heat and Mass Transfer International Conference 2009, MNHMT2009
CountryChina
CityShanghai
Period09-12-1809-12-21

All Science Journal Classification (ASJC) codes

  • Fluid Flow and Transfer Processes

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    Wang, Y. C., Chen, J. L., Liao, M. L., Chen, C., Chen, Y. C., & Hwang, C. C. (2010). Stress and temperature analysis of the copper substrate indented with nanotubes and nanocones. In Proceedings of the ASME Micro/Nanoscale Heat and Mass Transfer International Conference 2009, MNHMT2009 (pp. 587-589). (Proceedings of the ASME Micro/Nanoscale Heat and Mass Transfer International Conference 2009, MNHMT2009; Vol. 2). https://doi.org/10.1115/MNHMT2009-18379