Stress and temperature analysis of the copper substrate indented with nanotubes and nanocones

Yun-Che Wang, Jun Liang Chen, Ming Liang Liao, Chuan Chen, Yan Chi Chen, Chi-Chuan Hwang

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

It has been shown that nanotubes and nanocones are most effective to make indents with large aspect ratios,. Detailed studies in the heat transfer processes under the nano-scale indentation, and the accompanying stress distributions are required much attention. In this study, the copper substrate was indented with a nanotube or nano-cone. It is found that nano-cones may make indents with larger aspect ratios than the nanotubes due to the local shell buckling. Time-domain heat transfer and stress analysis was carried out by using a control-volume technique with an atomic spatial resolution, except near the boundaries. The effect of temperatures and stresses on the changes of the microstructures of the substrate will be discussed.

Original languageEnglish
Title of host publicationProceedings of the ASME Micro/Nanoscale Heat and Mass Transfer International Conference 2009, MNHMT2009
Pages587-589
Number of pages3
Volume2
DOIs
Publication statusPublished - 2010
EventASME 2009 Micro/Nanoscale Heat and Mass Transfer International Conference 2009, MNHMT2009 - Shanghai, China
Duration: 2009 Dec 182009 Dec 21

Other

OtherASME 2009 Micro/Nanoscale Heat and Mass Transfer International Conference 2009, MNHMT2009
CountryChina
CityShanghai
Period09-12-1809-12-21

Fingerprint

Nanotubes
Copper
Cones
Aspect ratio
Substrates
Heat transfer
Stress analysis
Indentation
Temperature
Buckling
Stress concentration
Microstructure

All Science Journal Classification (ASJC) codes

  • Fluid Flow and Transfer Processes

Cite this

Wang, Y-C., Chen, J. L., Liao, M. L., Chen, C., Chen, Y. C., & Hwang, C-C. (2010). Stress and temperature analysis of the copper substrate indented with nanotubes and nanocones. In Proceedings of the ASME Micro/Nanoscale Heat and Mass Transfer International Conference 2009, MNHMT2009 (Vol. 2, pp. 587-589) https://doi.org/10.1115/MNHMT2009-18379
Wang, Yun-Che ; Chen, Jun Liang ; Liao, Ming Liang ; Chen, Chuan ; Chen, Yan Chi ; Hwang, Chi-Chuan. / Stress and temperature analysis of the copper substrate indented with nanotubes and nanocones. Proceedings of the ASME Micro/Nanoscale Heat and Mass Transfer International Conference 2009, MNHMT2009. Vol. 2 2010. pp. 587-589
@inproceedings{d7d1b1b58e144f79a3949c60c9910cf0,
title = "Stress and temperature analysis of the copper substrate indented with nanotubes and nanocones",
abstract = "It has been shown that nanotubes and nanocones are most effective to make indents with large aspect ratios,. Detailed studies in the heat transfer processes under the nano-scale indentation, and the accompanying stress distributions are required much attention. In this study, the copper substrate was indented with a nanotube or nano-cone. It is found that nano-cones may make indents with larger aspect ratios than the nanotubes due to the local shell buckling. Time-domain heat transfer and stress analysis was carried out by using a control-volume technique with an atomic spatial resolution, except near the boundaries. The effect of temperatures and stresses on the changes of the microstructures of the substrate will be discussed.",
author = "Yun-Che Wang and Chen, {Jun Liang} and Liao, {Ming Liang} and Chuan Chen and Chen, {Yan Chi} and Chi-Chuan Hwang",
year = "2010",
doi = "10.1115/MNHMT2009-18379",
language = "English",
isbn = "9780791843895",
volume = "2",
pages = "587--589",
booktitle = "Proceedings of the ASME Micro/Nanoscale Heat and Mass Transfer International Conference 2009, MNHMT2009",

}

Wang, Y-C, Chen, JL, Liao, ML, Chen, C, Chen, YC & Hwang, C-C 2010, Stress and temperature analysis of the copper substrate indented with nanotubes and nanocones. in Proceedings of the ASME Micro/Nanoscale Heat and Mass Transfer International Conference 2009, MNHMT2009. vol. 2, pp. 587-589, ASME 2009 Micro/Nanoscale Heat and Mass Transfer International Conference 2009, MNHMT2009, Shanghai, China, 09-12-18. https://doi.org/10.1115/MNHMT2009-18379

Stress and temperature analysis of the copper substrate indented with nanotubes and nanocones. / Wang, Yun-Che; Chen, Jun Liang; Liao, Ming Liang; Chen, Chuan; Chen, Yan Chi; Hwang, Chi-Chuan.

Proceedings of the ASME Micro/Nanoscale Heat and Mass Transfer International Conference 2009, MNHMT2009. Vol. 2 2010. p. 587-589.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

TY - GEN

T1 - Stress and temperature analysis of the copper substrate indented with nanotubes and nanocones

AU - Wang, Yun-Che

AU - Chen, Jun Liang

AU - Liao, Ming Liang

AU - Chen, Chuan

AU - Chen, Yan Chi

AU - Hwang, Chi-Chuan

PY - 2010

Y1 - 2010

N2 - It has been shown that nanotubes and nanocones are most effective to make indents with large aspect ratios,. Detailed studies in the heat transfer processes under the nano-scale indentation, and the accompanying stress distributions are required much attention. In this study, the copper substrate was indented with a nanotube or nano-cone. It is found that nano-cones may make indents with larger aspect ratios than the nanotubes due to the local shell buckling. Time-domain heat transfer and stress analysis was carried out by using a control-volume technique with an atomic spatial resolution, except near the boundaries. The effect of temperatures and stresses on the changes of the microstructures of the substrate will be discussed.

AB - It has been shown that nanotubes and nanocones are most effective to make indents with large aspect ratios,. Detailed studies in the heat transfer processes under the nano-scale indentation, and the accompanying stress distributions are required much attention. In this study, the copper substrate was indented with a nanotube or nano-cone. It is found that nano-cones may make indents with larger aspect ratios than the nanotubes due to the local shell buckling. Time-domain heat transfer and stress analysis was carried out by using a control-volume technique with an atomic spatial resolution, except near the boundaries. The effect of temperatures and stresses on the changes of the microstructures of the substrate will be discussed.

UR - http://www.scopus.com/inward/record.url?scp=77954325927&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=77954325927&partnerID=8YFLogxK

U2 - 10.1115/MNHMT2009-18379

DO - 10.1115/MNHMT2009-18379

M3 - Conference contribution

SN - 9780791843895

VL - 2

SP - 587

EP - 589

BT - Proceedings of the ASME Micro/Nanoscale Heat and Mass Transfer International Conference 2009, MNHMT2009

ER -

Wang Y-C, Chen JL, Liao ML, Chen C, Chen YC, Hwang C-C. Stress and temperature analysis of the copper substrate indented with nanotubes and nanocones. In Proceedings of the ASME Micro/Nanoscale Heat and Mass Transfer International Conference 2009, MNHMT2009. Vol. 2. 2010. p. 587-589 https://doi.org/10.1115/MNHMT2009-18379