Stress and temperature analysis of the copper substrate indented with nanotubes and nanocones

Yun Che Wang; Jun Liang Chen; Ming Liang Liao; Chuan Chen; Yan Chi Chen; Chi Chuan Hwang

doi:10.1115/MNHMT2009-18379

Stress and temperature analysis of the copper substrate indented with nanotubes and nanocones

Yun Che Wang, Jun Liang Chen, Ming Liang Liao, Chuan Chen, Yan Chi Chen, Chi Chuan Hwang

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

It has been shown that nanotubes and nanocones are most effective to make indents with large aspect ratios,. Detailed studies in the heat transfer processes under the nano-scale indentation, and the accompanying stress distributions are required much attention. In this study, the copper substrate was indented with a nanotube or nano-cone. It is found that nano-cones may make indents with larger aspect ratios than the nanotubes due to the local shell buckling. Time-domain heat transfer and stress analysis was carried out by using a control-volume technique with an atomic spatial resolution, except near the boundaries. The effect of temperatures and stresses on the changes of the microstructures of the substrate will be discussed.

Original language	English
Title of host publication	Proceedings of the ASME Micro/Nanoscale Heat and Mass Transfer International Conference 2009, MNHMT2009
Pages	587-589
Number of pages	3
DOIs	https://doi.org/10.1115/MNHMT2009-18379
Publication status	Published - 2010 Jul 12
Event	ASME 2009 Micro/Nanoscale Heat and Mass Transfer International Conference 2009, MNHMT2009 - Shanghai, China Duration: 2009 Dec 18 → 2009 Dec 21

Publication series

Name	Proceedings of the ASME Micro/Nanoscale Heat and Mass Transfer International Conference 2009, MNHMT2009
Volume	2

Other

Other	ASME 2009 Micro/Nanoscale Heat and Mass Transfer International Conference 2009, MNHMT2009
Country/Territory	China
City	Shanghai
Period	09-12-18 → 09-12-21

All Science Journal Classification (ASJC) codes

Fluid Flow and Transfer Processes

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10.1115/MNHMT2009-18379

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Wang, Y. C., Chen, J. L., Liao, M. L., Chen, C., Chen, Y. C., & Hwang, C. C. (2010). Stress and temperature analysis of the copper substrate indented with nanotubes and nanocones. In Proceedings of the ASME Micro/Nanoscale Heat and Mass Transfer International Conference 2009, MNHMT2009 (pp. 587-589). (Proceedings of the ASME Micro/Nanoscale Heat and Mass Transfer International Conference 2009, MNHMT2009; Vol. 2). https://doi.org/10.1115/MNHMT2009-18379

Wang, Yun Che ; Chen, Jun Liang ; Liao, Ming Liang et al. / Stress and temperature analysis of the copper substrate indented with nanotubes and nanocones. Proceedings of the ASME Micro/Nanoscale Heat and Mass Transfer International Conference 2009, MNHMT2009. 2010. pp. 587-589 (Proceedings of the ASME Micro/Nanoscale Heat and Mass Transfer International Conference 2009, MNHMT2009).

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title = "Stress and temperature analysis of the copper substrate indented with nanotubes and nanocones",

abstract = "It has been shown that nanotubes and nanocones are most effective to make indents with large aspect ratios,. Detailed studies in the heat transfer processes under the nano-scale indentation, and the accompanying stress distributions are required much attention. In this study, the copper substrate was indented with a nanotube or nano-cone. It is found that nano-cones may make indents with larger aspect ratios than the nanotubes due to the local shell buckling. Time-domain heat transfer and stress analysis was carried out by using a control-volume technique with an atomic spatial resolution, except near the boundaries. The effect of temperatures and stresses on the changes of the microstructures of the substrate will be discussed.",

author = "Wang, {Yun Che} and Chen, {Jun Liang} and Liao, {Ming Liang} and Chuan Chen and Chen, {Yan Chi} and Hwang, {Chi Chuan}",

year = "2010",

month = jul,

day = "12",

doi = "10.1115/MNHMT2009-18379",

language = "English",

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pages = "587--589",

booktitle = "Proceedings of the ASME Micro/Nanoscale Heat and Mass Transfer International Conference 2009, MNHMT2009",

note = "ASME 2009 Micro/Nanoscale Heat and Mass Transfer International Conference 2009, MNHMT2009 ; Conference date: 18-12-2009 Through 21-12-2009",

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Wang, YC, Chen, JL, Liao, ML, Chen, C, Chen, YC & Hwang, CC 2010, Stress and temperature analysis of the copper substrate indented with nanotubes and nanocones. in Proceedings of the ASME Micro/Nanoscale Heat and Mass Transfer International Conference 2009, MNHMT2009. Proceedings of the ASME Micro/Nanoscale Heat and Mass Transfer International Conference 2009, MNHMT2009, vol. 2, pp. 587-589, ASME 2009 Micro/Nanoscale Heat and Mass Transfer International Conference 2009, MNHMT2009, Shanghai, China, 09-12-18. https://doi.org/10.1115/MNHMT2009-18379

Stress and temperature analysis of the copper substrate indented with nanotubes and nanocones. / Wang, Yun Che; Chen, Jun Liang; Liao, Ming Liang et al.
Proceedings of the ASME Micro/Nanoscale Heat and Mass Transfer International Conference 2009, MNHMT2009. 2010. p. 587-589 (Proceedings of the ASME Micro/Nanoscale Heat and Mass Transfer International Conference 2009, MNHMT2009; Vol. 2).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

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AB - It has been shown that nanotubes and nanocones are most effective to make indents with large aspect ratios,. Detailed studies in the heat transfer processes under the nano-scale indentation, and the accompanying stress distributions are required much attention. In this study, the copper substrate was indented with a nanotube or nano-cone. It is found that nano-cones may make indents with larger aspect ratios than the nanotubes due to the local shell buckling. Time-domain heat transfer and stress analysis was carried out by using a control-volume technique with an atomic spatial resolution, except near the boundaries. The effect of temperatures and stresses on the changes of the microstructures of the substrate will be discussed.

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Wang YC, Chen JL, Liao ML, Chen C, Chen YC, Hwang CC. Stress and temperature analysis of the copper substrate indented with nanotubes and nanocones. In Proceedings of the ASME Micro/Nanoscale Heat and Mass Transfer International Conference 2009, MNHMT2009. 2010. p. 587-589. (Proceedings of the ASME Micro/Nanoscale Heat and Mass Transfer International Conference 2009, MNHMT2009). doi: 10.1115/MNHMT2009-18379

Stress and temperature analysis of the copper substrate indented with nanotubes and nanocones

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