Stress intensity factors of interface corners

Chyanbin Hwu, T. L. Kuo

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

Stress singularity usually occurs near the interface corners, which may initiate failure of structures. Although several detailed studies have been done about the determination of their associated singular orders and stress intensity factors, very few failure criteria for general interface corners were successfully established based upon these parameters. Even the cracks in homogeneous media or the cracks lying along the interface between dissimilar materials are the special cases of the interface corners, the definitions of stress intensity factors proposed in the literature are usually not consistent with that of cracks. Thus, to have a universal failure criterion for the homogeneous cracks, interface cracks and interface corners, a unified definition for the stress intensity factors is indispensable. Moreover, according to the experience of crack problems, finding a stable and accurate approach to calculate the stress intensity factors is also important. Based upon the analytical solutions obtained previously for the multibonded anisotropic wedges and the well-known path-independent H-integral, in this paper we provide a unified definition and a stable computing approach for the stress intensity factors of interface corners.

Original languageEnglish
Title of host publicationProceedings - EMAP 2005
Subtitle of host publication2005 International Symposium on Electronics Materials and Packaging
Pages252-257
Number of pages6
DOIs
Publication statusPublished - 2005 Dec 1
EventEMAP 2005: 2005 International Symposium on Electronics Materials and Packaging - Tokyo, Japan
Duration: 2005 Dec 112005 Dec 14

Publication series

NameProceedings - EMAP 2005: 2005 International Symposium on Electronics Materials and Packaging
Volume2005

Other

OtherEMAP 2005: 2005 International Symposium on Electronics Materials and Packaging
CountryJapan
CityTokyo
Period05-12-1105-12-14

Fingerprint

Stress intensity factors
Cracks
Dissimilar materials

All Science Journal Classification (ASJC) codes

  • Engineering(all)

Cite this

Hwu, C., & Kuo, T. L. (2005). Stress intensity factors of interface corners. In Proceedings - EMAP 2005: 2005 International Symposium on Electronics Materials and Packaging (pp. 252-257). [1598271] (Proceedings - EMAP 2005: 2005 International Symposium on Electronics Materials and Packaging; Vol. 2005). https://doi.org/10.1109/EMAP.2005.1598271
Hwu, Chyanbin ; Kuo, T. L. / Stress intensity factors of interface corners. Proceedings - EMAP 2005: 2005 International Symposium on Electronics Materials and Packaging. 2005. pp. 252-257 (Proceedings - EMAP 2005: 2005 International Symposium on Electronics Materials and Packaging).
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Hwu, C & Kuo, TL 2005, Stress intensity factors of interface corners. in Proceedings - EMAP 2005: 2005 International Symposium on Electronics Materials and Packaging., 1598271, Proceedings - EMAP 2005: 2005 International Symposium on Electronics Materials and Packaging, vol. 2005, pp. 252-257, EMAP 2005: 2005 International Symposium on Electronics Materials and Packaging, Tokyo, Japan, 05-12-11. https://doi.org/10.1109/EMAP.2005.1598271

Stress intensity factors of interface corners. / Hwu, Chyanbin; Kuo, T. L.

Proceedings - EMAP 2005: 2005 International Symposium on Electronics Materials and Packaging. 2005. p. 252-257 1598271 (Proceedings - EMAP 2005: 2005 International Symposium on Electronics Materials and Packaging; Vol. 2005).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

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Hwu C, Kuo TL. Stress intensity factors of interface corners. In Proceedings - EMAP 2005: 2005 International Symposium on Electronics Materials and Packaging. 2005. p. 252-257. 1598271. (Proceedings - EMAP 2005: 2005 International Symposium on Electronics Materials and Packaging). https://doi.org/10.1109/EMAP.2005.1598271