Structural evolution of electroless nickel bump

Kwang Lung Lin, Chih Hau Wu

Research output: Contribution to journalArticlepeer-review

7 Citations (Scopus)

Abstract

An electroless nickel bump deposited from nickel sulfate solution was investigated for its structural evolution with respect to deposition parameters. The pad size, pitch size, and lead acetate concentration were found to affect the bump structure. Three types of representative structure, the broccoli edge, anisotropic, and pyramidal were identified. The effect of depositing parameters on the evolution of these structures is explained in terms of the adsorption behavior of additive and the diffusion mechanism of the nickel ions.

Original languageEnglish
Pages (from-to)C273-C276
JournalJournal of the Electrochemical Society
Volume150
Issue number5
DOIs
Publication statusPublished - 2003 May

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Renewable Energy, Sustainability and the Environment
  • Surfaces, Coatings and Films
  • Electrochemistry
  • Materials Chemistry

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