Structure and properties of diamond-like carbon nanocomposite films containing copper nanoparticles

Chun Chin Chen, Franklin Chau-Nan Hong

Research output: Contribution to journalArticle

67 Citations (Scopus)

Abstract

Diamond-like carbon (DLC) nanocomposite films, containing copper (Cu) nanocrystallites, were synthesized and studied. Cu bonds very weakly with carbon, and does not form a carbide phase. Therefore, Cu nanoparticles can be easily formed in a DLC matrix by depositing Cu and carbon together. The mechanical properties of DLC films that contain Cu nanoparticles are interesting since the film toughness may be increased by grain-matrix interface sliding. Hard, tough and stress-free DLC/Cu films were prepared by a sputtering Cu target in an argon/acetylene atmosphere while biasing the substrate with a radio frequency power supply. The residual stress of the film, calculated by Stoney's equation, was as low as 0.7 GPa. The reduced stress and the increased film toughness increased the critical load from 66 N for a conventional DLC film to 80 N for the DLC/Cu film, as measured in a scratch test. However, the DLC/Cu films were slightly less hard than the DLC films.

Original languageEnglish
Pages (from-to)261-269
Number of pages9
JournalApplied Surface Science
Volume242
Issue number3-4
DOIs
Publication statusPublished - 2005 Apr 15

Fingerprint

Diamond
Nanocomposite films
Carbon films
Copper
Diamonds
nanocomposites
Carbon
diamonds
Nanoparticles
copper
nanoparticles
Diamond like carbon films
carbon
Toughness
Acetylene
toughness
Nanocrystallites
Argon
Sputtering
Carbides

All Science Journal Classification (ASJC) codes

  • Surfaces, Coatings and Films

Cite this

@article{57feff36deba4361a9f75cb16245840d,
title = "Structure and properties of diamond-like carbon nanocomposite films containing copper nanoparticles",
abstract = "Diamond-like carbon (DLC) nanocomposite films, containing copper (Cu) nanocrystallites, were synthesized and studied. Cu bonds very weakly with carbon, and does not form a carbide phase. Therefore, Cu nanoparticles can be easily formed in a DLC matrix by depositing Cu and carbon together. The mechanical properties of DLC films that contain Cu nanoparticles are interesting since the film toughness may be increased by grain-matrix interface sliding. Hard, tough and stress-free DLC/Cu films were prepared by a sputtering Cu target in an argon/acetylene atmosphere while biasing the substrate with a radio frequency power supply. The residual stress of the film, calculated by Stoney's equation, was as low as 0.7 GPa. The reduced stress and the increased film toughness increased the critical load from 66 N for a conventional DLC film to 80 N for the DLC/Cu film, as measured in a scratch test. However, the DLC/Cu films were slightly less hard than the DLC films.",
author = "Chen, {Chun Chin} and Hong, {Franklin Chau-Nan}",
year = "2005",
month = "4",
day = "15",
doi = "10.1016/j.apsusc.2004.08.036",
language = "English",
volume = "242",
pages = "261--269",
journal = "Applied Surface Science",
issn = "0169-4332",
publisher = "Elsevier",
number = "3-4",

}

Structure and properties of diamond-like carbon nanocomposite films containing copper nanoparticles. / Chen, Chun Chin; Hong, Franklin Chau-Nan.

In: Applied Surface Science, Vol. 242, No. 3-4, 15.04.2005, p. 261-269.

Research output: Contribution to journalArticle

TY - JOUR

T1 - Structure and properties of diamond-like carbon nanocomposite films containing copper nanoparticles

AU - Chen, Chun Chin

AU - Hong, Franklin Chau-Nan

PY - 2005/4/15

Y1 - 2005/4/15

N2 - Diamond-like carbon (DLC) nanocomposite films, containing copper (Cu) nanocrystallites, were synthesized and studied. Cu bonds very weakly with carbon, and does not form a carbide phase. Therefore, Cu nanoparticles can be easily formed in a DLC matrix by depositing Cu and carbon together. The mechanical properties of DLC films that contain Cu nanoparticles are interesting since the film toughness may be increased by grain-matrix interface sliding. Hard, tough and stress-free DLC/Cu films were prepared by a sputtering Cu target in an argon/acetylene atmosphere while biasing the substrate with a radio frequency power supply. The residual stress of the film, calculated by Stoney's equation, was as low as 0.7 GPa. The reduced stress and the increased film toughness increased the critical load from 66 N for a conventional DLC film to 80 N for the DLC/Cu film, as measured in a scratch test. However, the DLC/Cu films were slightly less hard than the DLC films.

AB - Diamond-like carbon (DLC) nanocomposite films, containing copper (Cu) nanocrystallites, were synthesized and studied. Cu bonds very weakly with carbon, and does not form a carbide phase. Therefore, Cu nanoparticles can be easily formed in a DLC matrix by depositing Cu and carbon together. The mechanical properties of DLC films that contain Cu nanoparticles are interesting since the film toughness may be increased by grain-matrix interface sliding. Hard, tough and stress-free DLC/Cu films were prepared by a sputtering Cu target in an argon/acetylene atmosphere while biasing the substrate with a radio frequency power supply. The residual stress of the film, calculated by Stoney's equation, was as low as 0.7 GPa. The reduced stress and the increased film toughness increased the critical load from 66 N for a conventional DLC film to 80 N for the DLC/Cu film, as measured in a scratch test. However, the DLC/Cu films were slightly less hard than the DLC films.

UR - http://www.scopus.com/inward/record.url?scp=13444261122&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=13444261122&partnerID=8YFLogxK

U2 - 10.1016/j.apsusc.2004.08.036

DO - 10.1016/j.apsusc.2004.08.036

M3 - Article

AN - SCOPUS:13444261122

VL - 242

SP - 261

EP - 269

JO - Applied Surface Science

JF - Applied Surface Science

SN - 0169-4332

IS - 3-4

ER -