Studies of Interfacial Microstructures and Series Resistance on Electroplated and Hot-Dipped Sn-xCu Photovoltaic Modules

Kuan Jen Chen, Fei-Yi Hung, Truan-Sheng Lui, Lin Hsu

Research output: Contribution to journalArticle

2 Citations (Scopus)

Abstract

The present study applied molten Sn-xCu (x = 0.3, 0.7, 2.5, and 5.0 wt.%) alloy solders to a photovoltaic (PV) ribbon. A hot-dipped Sn-0.7Cu PV ribbon reflowed on a Si solar cell had the lowest series resistance of the tested module (Cu/Solder/Ag). After biasing for 72 h, the rapid growth of intermetallic compounds (IMCs) (Cu6Sn5, Ag3Sn) caused the series resistance of the module to increase by 52%. To improve the performance of the PV module, an electroplated PV ribbon was used in place of the hot-dipped one. The required solder thickness for the electroplated ribbon was one third that for hot-dipped ribbon. Applying less solder to a PV ribbon avoids the overgrowth of IMCs and thus enhances module conductivity.

Original languageEnglish
Pages (from-to)6028-6035
Number of pages8
JournalJournal of Electronic Materials
Volume47
Issue number10
DOIs
Publication statusPublished - 2018 Oct 1

Fingerprint

Soldering alloys
ribbons
modules
solders
microstructure
Microstructure
Intermetallics
intermetallics
Molten materials
Solar cells
solar cells
conductivity

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Electrical and Electronic Engineering
  • Materials Chemistry

Cite this

@article{34ca18febfc143b8bcc7233dc503fee3,
title = "Studies of Interfacial Microstructures and Series Resistance on Electroplated and Hot-Dipped Sn-xCu Photovoltaic Modules",
abstract = "The present study applied molten Sn-xCu (x = 0.3, 0.7, 2.5, and 5.0 wt.{\%}) alloy solders to a photovoltaic (PV) ribbon. A hot-dipped Sn-0.7Cu PV ribbon reflowed on a Si solar cell had the lowest series resistance of the tested module (Cu/Solder/Ag). After biasing for 72 h, the rapid growth of intermetallic compounds (IMCs) (Cu6Sn5, Ag3Sn) caused the series resistance of the module to increase by 52{\%}. To improve the performance of the PV module, an electroplated PV ribbon was used in place of the hot-dipped one. The required solder thickness for the electroplated ribbon was one third that for hot-dipped ribbon. Applying less solder to a PV ribbon avoids the overgrowth of IMCs and thus enhances module conductivity.",
author = "Chen, {Kuan Jen} and Fei-Yi Hung and Truan-Sheng Lui and Lin Hsu",
year = "2018",
month = "10",
day = "1",
doi = "10.1007/s11664-018-6483-3",
language = "English",
volume = "47",
pages = "6028--6035",
journal = "Journal of Electronic Materials",
issn = "0361-5235",
publisher = "Springer New York",
number = "10",

}

Studies of Interfacial Microstructures and Series Resistance on Electroplated and Hot-Dipped Sn-xCu Photovoltaic Modules. / Chen, Kuan Jen; Hung, Fei-Yi; Lui, Truan-Sheng; Hsu, Lin.

In: Journal of Electronic Materials, Vol. 47, No. 10, 01.10.2018, p. 6028-6035.

Research output: Contribution to journalArticle

TY - JOUR

T1 - Studies of Interfacial Microstructures and Series Resistance on Electroplated and Hot-Dipped Sn-xCu Photovoltaic Modules

AU - Chen, Kuan Jen

AU - Hung, Fei-Yi

AU - Lui, Truan-Sheng

AU - Hsu, Lin

PY - 2018/10/1

Y1 - 2018/10/1

N2 - The present study applied molten Sn-xCu (x = 0.3, 0.7, 2.5, and 5.0 wt.%) alloy solders to a photovoltaic (PV) ribbon. A hot-dipped Sn-0.7Cu PV ribbon reflowed on a Si solar cell had the lowest series resistance of the tested module (Cu/Solder/Ag). After biasing for 72 h, the rapid growth of intermetallic compounds (IMCs) (Cu6Sn5, Ag3Sn) caused the series resistance of the module to increase by 52%. To improve the performance of the PV module, an electroplated PV ribbon was used in place of the hot-dipped one. The required solder thickness for the electroplated ribbon was one third that for hot-dipped ribbon. Applying less solder to a PV ribbon avoids the overgrowth of IMCs and thus enhances module conductivity.

AB - The present study applied molten Sn-xCu (x = 0.3, 0.7, 2.5, and 5.0 wt.%) alloy solders to a photovoltaic (PV) ribbon. A hot-dipped Sn-0.7Cu PV ribbon reflowed on a Si solar cell had the lowest series resistance of the tested module (Cu/Solder/Ag). After biasing for 72 h, the rapid growth of intermetallic compounds (IMCs) (Cu6Sn5, Ag3Sn) caused the series resistance of the module to increase by 52%. To improve the performance of the PV module, an electroplated PV ribbon was used in place of the hot-dipped one. The required solder thickness for the electroplated ribbon was one third that for hot-dipped ribbon. Applying less solder to a PV ribbon avoids the overgrowth of IMCs and thus enhances module conductivity.

UR - http://www.scopus.com/inward/record.url?scp=85049686648&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=85049686648&partnerID=8YFLogxK

U2 - 10.1007/s11664-018-6483-3

DO - 10.1007/s11664-018-6483-3

M3 - Article

AN - SCOPUS:85049686648

VL - 47

SP - 6028

EP - 6035

JO - Journal of Electronic Materials

JF - Journal of Electronic Materials

SN - 0361-5235

IS - 10

ER -