Studies of Interfacial Microstructures and Series Resistance on Electroplated and Hot-Dipped Sn-xCu Photovoltaic Modules

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3 Citations (Scopus)

Abstract

The present study applied molten Sn-xCu (x = 0.3, 0.7, 2.5, and 5.0 wt.%) alloy solders to a photovoltaic (PV) ribbon. A hot-dipped Sn-0.7Cu PV ribbon reflowed on a Si solar cell had the lowest series resistance of the tested module (Cu/Solder/Ag). After biasing for 72 h, the rapid growth of intermetallic compounds (IMCs) (Cu6Sn5, Ag3Sn) caused the series resistance of the module to increase by 52%. To improve the performance of the PV module, an electroplated PV ribbon was used in place of the hot-dipped one. The required solder thickness for the electroplated ribbon was one third that for hot-dipped ribbon. Applying less solder to a PV ribbon avoids the overgrowth of IMCs and thus enhances module conductivity.

Original languageEnglish
Pages (from-to)6028-6035
Number of pages8
JournalJournal of Electronic Materials
Volume47
Issue number10
DOIs
Publication statusPublished - 2018 Oct 1

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Electrical and Electronic Engineering
  • Materials Chemistry

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