Study of a compression-molding process for ultraviolet light-emitting diode exposure systems via finite-element analysis

Kuo Tsai Wu, Sheng Jye Hwang, Huei Huang Lee

Research output: Contribution to journalArticle

Abstract

Although wafer-level camera lenses are a very promising technology, problems such as warpage with time and non-uniform thickness of products still exist. In this study, finite element simulation was performed to simulate the compression molding process for acquiring the pressure distribution on the product on completion of the process and predicting the deformation with respect to the pressure distribution. Results show that the single-gate compression molding process significantly increases the pressure at the center of the product, whereas the multi-gate compressing molding process can effectively distribute the pressure. This study evaluated the non-uniform thickness of product and changes in the process parameters through computer simulations, which could help to improve the compression molding process.

Original languageEnglish
Article number1392
JournalSensors (Switzerland)
Volume17
Issue number6
DOIs
Publication statusPublished - 2017 Jun 15

All Science Journal Classification (ASJC) codes

  • Analytical Chemistry
  • Biochemistry
  • Atomic and Molecular Physics, and Optics
  • Instrumentation
  • Electrical and Electronic Engineering

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