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Study of electromigration-induced failures on Cu pillar bumps joined to OSP and ENEPIG substrates
- Yu Hsiang Hsiao
- , Kwang-Lung Lin
- , Chiu Wen Lee
- , Yu Hsiu Shao
- , Yi Shao Lai
Research output: Contribution to journal › Article › peer-review
9
Citations
(Scopus)