Abstract
Wafer-level camera lenses are a very promising process for camera lens fabrication. However, there exist some problems with this technology, such as uneven exposure due to curing non-uniformities. In this study, an optical simulation was implemented to simulate the UV light-emitting diodes (LEDs) curing process. We design the LED arrangement, and then find the corresponding LED and adjust the LED power to improve exposure uniformity. The simulation results are very close to the experimental data, and the uniformity is also within the standard range.
Original language | English |
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Article number | 4110 |
Journal | Applied Sciences (Switzerland) |
Volume | 9 |
Issue number | 19 |
DOIs | |
Publication status | Published - 2019 Oct 1 |
All Science Journal Classification (ASJC) codes
- General Materials Science
- Instrumentation
- General Engineering
- Process Chemistry and Technology
- Computer Science Applications
- Fluid Flow and Transfer Processes