Study of P-V-T-C Relation of EMC

Yi San Chang, Sheng-Jye Hwang, Huei-Huang Lee, Durn Yuan Huang

Research output: Contribution to journalArticlepeer-review

26 Citations (Scopus)

Abstract

A two-plunger-type dilatometer was designed and fabricated to measure cure-induced volume changes of epoxy molding compound (EMC). The device is suitable for studying volume change of material systems that are fast reacting and with high conversions and high viscosity like commercial EMC. In this paper, the conversion rate was determined by DSC. Interactions of volume change, pressure, temperature, and conversion were measured. In the experiment, two different temperatures: 172°C, 180°C and four different pressures: 30, 50, 80, and 100 kgf/cm 2 were applied. The total number of conditions in this experiment is 8. Volume change of EMC due to thermal expansion, cure shrinkage, and thermal contraction under fixed temperature and pressure was measured. For higher pressure, the final volume change will be higher.

Original languageEnglish
Pages (from-to)371-373
Number of pages3
JournalJournal of Electronic Packaging, Transactions of the ASME
Volume124
Issue number4
DOIs
Publication statusPublished - 2002 Dec 1

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Mechanics of Materials
  • Computer Science Applications
  • Electrical and Electronic Engineering

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