Abstract
Owing to the CTE (Coefficient of Thermal Expansion) mismatch among solder joints, IC (Integrated Circuit) chip, and PCB (Printed Circuit Board), elec- tronic packages shall experience fatigue failure after going though a period of ther- mal cycling. As a major means to enhance the reliability of the solder joints, un- derfill is often dispensed to fill the gap between the die and the substrate. This study aims at investigating how the underfill may affect the thermal fatigue life of WLCSP (Wafer Level Chip Scale Package) by means of FEA (finite element analysis). In this study, the thermal fatigue life of the WLCSP was simulated us- ing full-model. For comparison with the FEA simulations, experiments were also conducted for a few WLCSP with/without underfill.
| Original language | English |
|---|---|
| Pages (from-to) | 83-103 |
| Number of pages | 21 |
| Journal | CMES - Computer Modeling in Engineering and Sciences |
| Volume | 40 |
| Issue number | 1 |
| Publication status | Published - 2009 |
All Science Journal Classification (ASJC) codes
- Software
- Modelling and Simulation
- Computer Science Applications