Study of thin film adhesion properties of multilayer flexible electronics composites

C. C. Li, Z. H. Liu, C. T. Pan, J. K. Tseng, H. L. Huang, S. W. Mao, S. C. Shen, S. J. Chang

Research output: Chapter in Book/Report/Conference proceedingConference contribution

6 Citations (Scopus)

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Engineering & Materials Science