Study on microstructure and shear strength of Sn-Ag-Sb solder joints

Hwa Teng Lee, Tain Long Liao, Ming Hung Chen

Research output: Chapter in Book/Report/Conference proceedingConference contribution

8 Citations (Scopus)

Abstract

This study investigates the microstructure, intermetallic compound (IMC) morphology and shear strength of Sn4.38Ag solder joints with different percentages of Sb content. The paper also evaluates, and compares, the thermal resistance of solder joints with different Sb content by means of high temperature storage testing. In order to achieve solder joints of the size found in the BGA package, this study used pure copper wires of 1 mm diameter as substrates for hot-dipping soldering. Solders with different compositions were selected for investigation, namely Sn4.38Ag, Sn3.9Ag0.9Sb, Sn4.4Ag1.44Sb and Sn4.11Ag1.86Sb, while a Sn40Pb solder was chosen for comparison purposes. High temperature storage testing was performed after soldering, with storage temperatures of 150°C and 200°C, respectively, and storage times of 0, 25, 100, 228 and 625 hours, respectively. Experimental results show that most of the Sb which is added to the solder is soluted in the β-Sn matrix, with the remainder reacting with the Sn and Ag atoms to form an ε-Ag3(Sn,Sb) compound.

Original languageEnglish
Title of host publicationAdvances in Electronic Materials and Packaging 2001
EditorsS.B. Lee, K.W. Paik
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages315-322
Number of pages8
ISBN (Electronic)0780371577, 9780780371576
DOIs
Publication statusPublished - 2001 Jan 1
Event3rd International Symposium on Electronic Materials and Packaging, EMAP 2001 - Jeju Island, Korea, Republic of
Duration: 2001 Nov 192001 Nov 22

Publication series

NameAdvances in Electronic Materials and Packaging 2001

Other

Other3rd International Symposium on Electronic Materials and Packaging, EMAP 2001
CountryKorea, Republic of
CityJeju Island
Period01-11-1901-11-22

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

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