TY - GEN
T1 - Study on microstructure and shear strength of Sn-Ag-Sb solder joints
AU - Lee, Hwa Teng
AU - Liao, Tain Long
AU - Chen, Ming Hung
N1 - Publisher Copyright:
© 2001 IEEE.
PY - 2001
Y1 - 2001
N2 - This study investigates the microstructure, intermetallic compound (IMC) morphology and shear strength of Sn4.38Ag solder joints with different percentages of Sb content. The paper also evaluates, and compares, the thermal resistance of solder joints with different Sb content by means of high temperature storage testing. In order to achieve solder joints of the size found in the BGA package, this study used pure copper wires of 1 mm diameter as substrates for hot-dipping soldering. Solders with different compositions were selected for investigation, namely Sn4.38Ag, Sn3.9Ag0.9Sb, Sn4.4Ag1.44Sb and Sn4.11Ag1.86Sb, while a Sn40Pb solder was chosen for comparison purposes. High temperature storage testing was performed after soldering, with storage temperatures of 150°C and 200°C, respectively, and storage times of 0, 25, 100, 228 and 625 hours, respectively. Experimental results show that most of the Sb which is added to the solder is soluted in the β-Sn matrix, with the remainder reacting with the Sn and Ag atoms to form an ε-Ag3(Sn,Sb) compound.
AB - This study investigates the microstructure, intermetallic compound (IMC) morphology and shear strength of Sn4.38Ag solder joints with different percentages of Sb content. The paper also evaluates, and compares, the thermal resistance of solder joints with different Sb content by means of high temperature storage testing. In order to achieve solder joints of the size found in the BGA package, this study used pure copper wires of 1 mm diameter as substrates for hot-dipping soldering. Solders with different compositions were selected for investigation, namely Sn4.38Ag, Sn3.9Ag0.9Sb, Sn4.4Ag1.44Sb and Sn4.11Ag1.86Sb, while a Sn40Pb solder was chosen for comparison purposes. High temperature storage testing was performed after soldering, with storage temperatures of 150°C and 200°C, respectively, and storage times of 0, 25, 100, 228 and 625 hours, respectively. Experimental results show that most of the Sb which is added to the solder is soluted in the β-Sn matrix, with the remainder reacting with the Sn and Ag atoms to form an ε-Ag3(Sn,Sb) compound.
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U2 - 10.1109/EMAP.2001.984003
DO - 10.1109/EMAP.2001.984003
M3 - Conference contribution
AN - SCOPUS:33645162276
T3 - Advances in Electronic Materials and Packaging 2001
SP - 315
EP - 322
BT - Advances in Electronic Materials and Packaging 2001
A2 - Lee, S.B.
A2 - Paik, K.W.
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 3rd International Symposium on Electronic Materials and Packaging, EMAP 2001
Y2 - 19 November 2001 through 22 November 2001
ER -