Study on microstructure and shear strength of Sn-Ag-Sb solder joints

Hwa Teng Lee, Tain Long Liao, Ming Hung Chen

Research output: Chapter in Book/Report/Conference proceedingConference contribution

8 Citations (Scopus)

Fingerprint

Dive into the research topics of 'Study on microstructure and shear strength of Sn-Ag-Sb solder joints'. Together they form a unique fingerprint.

Engineering & Materials Science

Chemical Compounds