Study on the performance of nanocomposite wire guides in wire sawing process

Chun-Hui Chung, Chien Hong Lin

Research output: Contribution to journalArticle

Abstract

In semiconductor wafer manufacturing, wire sawing is the first machining process to slice an ingot into hundreds of wafers. The cutting tool is a tiny wire which is wound on the wire guides. The material of the wire guides is essential to stabilize the process and to control the wafer thickness. However, there are few studies on the materials and the properties of the wire guides. In order to enhance the performance of wire sawing, this study investigated wire sawing process with the guides made of polyurethane reinforced by nanoTiO2 (PU/TiO2) and nanographite (PU/graphite). The results show the PU reinforced by nanoTiO2 was outperformed in wear resistance, although the surface roughness was slightly worse than the PU reinforced by nanographite.

Original languageEnglish
Article number1840077
JournalInternational Journal of Modern Physics B
Volume32
Issue number19
DOIs
Publication statusPublished - 2018 Jul 30

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nanocomposites
wire
wafers
ingots
wear resistance
machining
surface roughness
manufacturing

All Science Journal Classification (ASJC) codes

  • Statistical and Nonlinear Physics
  • Condensed Matter Physics

Cite this

@article{97b3ab3ad4e44928b086f3a23f8ea4e3,
title = "Study on the performance of nanocomposite wire guides in wire sawing process",
abstract = "In semiconductor wafer manufacturing, wire sawing is the first machining process to slice an ingot into hundreds of wafers. The cutting tool is a tiny wire which is wound on the wire guides. The material of the wire guides is essential to stabilize the process and to control the wafer thickness. However, there are few studies on the materials and the properties of the wire guides. In order to enhance the performance of wire sawing, this study investigated wire sawing process with the guides made of polyurethane reinforced by nanoTiO2 (PU/TiO2) and nanographite (PU/graphite). The results show the PU reinforced by nanoTiO2 was outperformed in wear resistance, although the surface roughness was slightly worse than the PU reinforced by nanographite.",
author = "Chun-Hui Chung and Lin, {Chien Hong}",
year = "2018",
month = "7",
day = "30",
doi = "10.1142/S0217979218400775",
language = "English",
volume = "32",
journal = "International Journal of Modern Physics B",
issn = "0217-9792",
publisher = "World Scientific Publishing Co. Pte Ltd",
number = "19",

}

Study on the performance of nanocomposite wire guides in wire sawing process. / Chung, Chun-Hui; Lin, Chien Hong.

In: International Journal of Modern Physics B, Vol. 32, No. 19, 1840077, 30.07.2018.

Research output: Contribution to journalArticle

TY - JOUR

T1 - Study on the performance of nanocomposite wire guides in wire sawing process

AU - Chung, Chun-Hui

AU - Lin, Chien Hong

PY - 2018/7/30

Y1 - 2018/7/30

N2 - In semiconductor wafer manufacturing, wire sawing is the first machining process to slice an ingot into hundreds of wafers. The cutting tool is a tiny wire which is wound on the wire guides. The material of the wire guides is essential to stabilize the process and to control the wafer thickness. However, there are few studies on the materials and the properties of the wire guides. In order to enhance the performance of wire sawing, this study investigated wire sawing process with the guides made of polyurethane reinforced by nanoTiO2 (PU/TiO2) and nanographite (PU/graphite). The results show the PU reinforced by nanoTiO2 was outperformed in wear resistance, although the surface roughness was slightly worse than the PU reinforced by nanographite.

AB - In semiconductor wafer manufacturing, wire sawing is the first machining process to slice an ingot into hundreds of wafers. The cutting tool is a tiny wire which is wound on the wire guides. The material of the wire guides is essential to stabilize the process and to control the wafer thickness. However, there are few studies on the materials and the properties of the wire guides. In order to enhance the performance of wire sawing, this study investigated wire sawing process with the guides made of polyurethane reinforced by nanoTiO2 (PU/TiO2) and nanographite (PU/graphite). The results show the PU reinforced by nanoTiO2 was outperformed in wear resistance, although the surface roughness was slightly worse than the PU reinforced by nanographite.

UR - http://www.scopus.com/inward/record.url?scp=85049583577&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=85049583577&partnerID=8YFLogxK

U2 - 10.1142/S0217979218400775

DO - 10.1142/S0217979218400775

M3 - Article

AN - SCOPUS:85049583577

VL - 32

JO - International Journal of Modern Physics B

JF - International Journal of Modern Physics B

SN - 0217-9792

IS - 19

M1 - 1840077

ER -