TY - JOUR
T1 - Study on the performance of nanocomposite wire guides in wire sawing process
AU - Chung, Chunhui
AU - Lin, Chien Hong
N1 - Funding Information:
This work was supported by the Ministry of Science and Technology with Grant No. 105-2221-E-011-042-MY2 and National Taiwan University of Science and Technology.
Publisher Copyright:
© 2018 World Scientific Publishing Company.
PY - 2018/7/30
Y1 - 2018/7/30
N2 - In semiconductor wafer manufacturing, wire sawing is the first machining process to slice an ingot into hundreds of wafers. The cutting tool is a tiny wire which is wound on the wire guides. The material of the wire guides is essential to stabilize the process and to control the wafer thickness. However, there are few studies on the materials and the properties of the wire guides. In order to enhance the performance of wire sawing, this study investigated wire sawing process with the guides made of polyurethane reinforced by nanoTiO2 (PU/TiO2) and nanographite (PU/graphite). The results show the PU reinforced by nanoTiO2 was outperformed in wear resistance, although the surface roughness was slightly worse than the PU reinforced by nanographite.
AB - In semiconductor wafer manufacturing, wire sawing is the first machining process to slice an ingot into hundreds of wafers. The cutting tool is a tiny wire which is wound on the wire guides. The material of the wire guides is essential to stabilize the process and to control the wafer thickness. However, there are few studies on the materials and the properties of the wire guides. In order to enhance the performance of wire sawing, this study investigated wire sawing process with the guides made of polyurethane reinforced by nanoTiO2 (PU/TiO2) and nanographite (PU/graphite). The results show the PU reinforced by nanoTiO2 was outperformed in wear resistance, although the surface roughness was slightly worse than the PU reinforced by nanographite.
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U2 - 10.1142/S0217979218400775
DO - 10.1142/S0217979218400775
M3 - Article
AN - SCOPUS:85049583577
SN - 0217-9792
VL - 32
JO - International Journal of Modern Physics B
JF - International Journal of Modern Physics B
IS - 19
M1 - 1840077
ER -