A new approach for fabricating macroscopic (— 10X 10X10 mm3 structures with micrometer accuracy has been developed. This approach combines the precision of semiconductor processing and fiber optic technologies. A (100) silicon wafer is anisotropicaily etched to create four orthogonal v-grooves and an aperture on each 10 X 12 mm die. Precision 308 μm optical fibers are sandwiched between the die to align the v-grooves. The fiber is then anodically bonded to the die above and below it. This procedure is repeated to create thick structures and a stack of 5 or 6 die will be used to create a miniature scanning electron microscope (MSEM). Two die in the structure will have a segmented electrode to deflect the beam and correct for astigmatism. The entire structure is ultrahigh vacuum compatible. The performance of a SEM improves as its length is reduced and a suh-cm 2 keV MSEM with a field emission source should have approximately 1 nm resolution. A low-voltage high-resolution MSEM would be useful for the examination of biological specimens and semiconductors with a minimum of damage. The first MSEM will be tested with existing 6 μm thermionic sources. In the future a micromachined field emission source will be used. The stacking technology presented in this paper can produce an array of MSEMs 1–30 mm in length with a 1 mm or larger period. A key question being addressed by this research is the optimum size for a low-voltage MSEM which will be determined by the required spatial resolution, field of view, and working distance.
|Number of pages||6|
|Journal||Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films|
|Publication status||Published - 1992 Jan 1|
All Science Journal Classification (ASJC) codes
- Condensed Matter Physics
- Surfaces and Interfaces
- Surfaces, Coatings and Films