Suppressing growth of the Cu 5Zn 8 intermetallic layer in Sn-Zn-Ag-Al-Ga/Cu solder joints

R. S. Lai, K. L. Lin, B. Salam

Research output: Contribution to journalArticle

15 Citations (Scopus)

Abstract

Cu 5Zn 8 normally forms between Sn-Zn solder and Cu metallization. In this study, the growth of the intermetallic compound (IMC) layer is slowed by increasing the silver content in the Sn-8.5Zn-Ag-Al-Ga/Cu system. Experimental results showed that the total thickness of the IMC layers formed with 1.5 wt.% silver content was about half that without silver. The reduction might be due to the formation of the intermetallic compound (Ag,Cu)-Zn at the interface in addition to silver.

Original languageEnglish
Pages (from-to)88-92
Number of pages5
JournalJournal of Electronic Materials
Volume38
Issue number1
DOIs
Publication statusPublished - 2009 Jan 1

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Electrical and Electronic Engineering
  • Materials Chemistry

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