Suppressing growth of the Cu 5Zn 8 intermetallic layer in Sn-Zn-Ag-Al-Ga/Cu solder joints

R. S. Lai; K. L. Lin; B. Salam

doi:10.1007/s11664-008-0579-0

Suppressing growth of the Cu ₅Zn ₈ intermetallic layer in Sn-Zn-Ag-Al-Ga/Cu solder joints

R. S. Lai, K. L. Lin, B. Salam

Research output: Contribution to journal › Article › peer-review

17 Citations (Scopus)

Abstract

Cu ₅Zn ₈ normally forms between Sn-Zn solder and Cu metallization. In this study, the growth of the intermetallic compound (IMC) layer is slowed by increasing the silver content in the Sn-8.5Zn-Ag-Al-Ga/Cu system. Experimental results showed that the total thickness of the IMC layers formed with 1.5 wt.% silver content was about half that without silver. The reduction might be due to the formation of the intermetallic compound (Ag,Cu)-Zn at the interface in addition to silver.

Original language	English
Pages (from-to)	88-92
Number of pages	5
Journal	Journal of Electronic Materials
Volume	38
Issue number	1
DOIs	https://doi.org/10.1007/s11664-008-0579-0
Publication status	Published - 2009 Jan

All Science Journal Classification (ASJC) codes

Electronic, Optical and Magnetic Materials
Condensed Matter Physics
Electrical and Electronic Engineering
Materials Chemistry

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10.1007/s11664-008-0579-0

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@article{00c10f3bc60d41e5b5769e15cfe23db0,

title = "Suppressing growth of the Cu 5Zn 8 intermetallic layer in Sn-Zn-Ag-Al-Ga/Cu solder joints",

abstract = "Cu 5Zn 8 normally forms between Sn-Zn solder and Cu metallization. In this study, the growth of the intermetallic compound (IMC) layer is slowed by increasing the silver content in the Sn-8.5Zn-Ag-Al-Ga/Cu system. Experimental results showed that the total thickness of the IMC layers formed with 1.5 wt.% silver content was about half that without silver. The reduction might be due to the formation of the intermetallic compound (Ag,Cu)-Zn at the interface in addition to silver.",

author = "Lai, {R. S.} and Lin, {K. L.} and B. Salam",

note = "Funding Information: The authors gratefully acknowledge the financial support from the National Science Council of the Republic of China Taiwan under the projects NSC93-2216-E-006-011 and NSC93-2216-E-006-022. The authors also thank the NCKU project of Promoting Academic Excellence & Developing World Class Research Center: D96-2700. The authors also thank Dr. Jagjiwan Mittal for his assistance in language correction.",

year = "2009",

month = jan,

doi = "10.1007/s11664-008-0579-0",

language = "English",

volume = "38",

pages = "88--92",

journal = "Journal of Electronic Materials",

issn = "0361-5235",

publisher = "Springer New York",

number = "1",

}

TY - JOUR

T1 - Suppressing growth of the Cu 5Zn 8 intermetallic layer in Sn-Zn-Ag-Al-Ga/Cu solder joints

AU - Lai, R. S.

AU - Lin, K. L.

AU - Salam, B.

N1 - Funding Information: The authors gratefully acknowledge the financial support from the National Science Council of the Republic of China Taiwan under the projects NSC93-2216-E-006-011 and NSC93-2216-E-006-022. The authors also thank the NCKU project of Promoting Academic Excellence & Developing World Class Research Center: D96-2700. The authors also thank Dr. Jagjiwan Mittal for his assistance in language correction.

PY - 2009/1

Y1 - 2009/1

N2 - Cu 5Zn 8 normally forms between Sn-Zn solder and Cu metallization. In this study, the growth of the intermetallic compound (IMC) layer is slowed by increasing the silver content in the Sn-8.5Zn-Ag-Al-Ga/Cu system. Experimental results showed that the total thickness of the IMC layers formed with 1.5 wt.% silver content was about half that without silver. The reduction might be due to the formation of the intermetallic compound (Ag,Cu)-Zn at the interface in addition to silver.

AB - Cu 5Zn 8 normally forms between Sn-Zn solder and Cu metallization. In this study, the growth of the intermetallic compound (IMC) layer is slowed by increasing the silver content in the Sn-8.5Zn-Ag-Al-Ga/Cu system. Experimental results showed that the total thickness of the IMC layers formed with 1.5 wt.% silver content was about half that without silver. The reduction might be due to the formation of the intermetallic compound (Ag,Cu)-Zn at the interface in addition to silver.

UR - http://www.scopus.com/inward/record.url?scp=57649157645&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=57649157645&partnerID=8YFLogxK

U2 - 10.1007/s11664-008-0579-0

DO - 10.1007/s11664-008-0579-0

M3 - Article

AN - SCOPUS:57649157645

SN - 0361-5235

VL - 38

SP - 88

EP - 92

JO - Journal of Electronic Materials

JF - Journal of Electronic Materials

IS - 1

ER -

Suppressing growth of the Cu ₅Zn ₈ intermetallic layer in Sn-Zn-Ag-Al-Ga/Cu solder joints

Abstract

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