Surface warpage measurement of wood at elevated temperature by shadow moiré method

Terry Yuan Fang Chen, Yu Sheng Chen

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

A full-field method to measure the surface warpage of wood plate at elevated temperature by phase-shifted shadow moiré method is presented. Test of the method on a cypress wood plate is demonstrated. A comparison of the test results at room temperature to the ones obtained by contact type sensor was made. A good agreement between them is shown. Further measurement of the plate warpage at elevated temperature reveals the warping behavior of wood plate.

Original languageEnglish
Title of host publicationSensors, Measurement and Intelligent Materials
Pages799-802
Number of pages4
DOIs
Publication statusPublished - 2013 Mar 12
Event2012 International Conference on Sensors, Measurement and Intelligent Materials, ICSMIM 2012 - Guilin, China
Duration: 2012 Dec 262012 Dec 27

Publication series

NameApplied Mechanics and Materials
Volume303-306
ISSN (Print)1660-9336
ISSN (Electronic)1662-7482

Other

Other2012 International Conference on Sensors, Measurement and Intelligent Materials, ICSMIM 2012
CountryChina
CityGuilin
Period12-12-2612-12-27

All Science Journal Classification (ASJC) codes

  • Engineering(all)

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  • Cite this

    Chen, T. Y. F., & Chen, Y. S. (2013). Surface warpage measurement of wood at elevated temperature by shadow moiré method. In Sensors, Measurement and Intelligent Materials (pp. 799-802). (Applied Mechanics and Materials; Vol. 303-306). https://doi.org/10.4028/www.scientific.net/AMM.303-306.799