A positive-working, aqueous-base-developable photosensitive polyimide precursor based on poly(amic ester)-bearing phenolic hydroxyl groups and a diazonaphthoquinone photosensitive compound was developed. The poly(amic ester) was prepared from a direct polymerization of 2,2′-bis-(3-amino-4-hydroxyphenyl)hexafluoropropane and bis(n-butyl)ester of pyromellitic acid in the presence of phenylphosphonic dichloride as an activator. Subsequently, the thermal imidization of the poly(amic ester) precursor at 300°C produced the corresponding polyimide. The inherent viscosity of the precursor polymer was 0.23 dL/g. The cyclized polyimide showed a glass-transition temperature at 356°C and a 5% weight loss at 474°C in nitrogen. The structures of the precursor polymer and the fully cyclized polymer were characterized by Fourier transform infrared spectroscopy and 1H-NMR. The photosensitive polyimide precursor containing 25 wt% diazonaphthoquinone photoactive compound showed a sensitivity of 150 mJ/cm2 and a contrast of 1.65 in a 3 μm film with 1.25 wt% tetramethylammonium hydroxide developer. A pattern with a resolution of 10 μm was obtained from this composition.
All Science Journal Classification (ASJC) codes
- Surfaces, Coatings and Films
- Polymers and Plastics
- Materials Chemistry