System thermal analysis of 3D IC on ESL virtual platform

Lih Yih Chiou, Liang Ying Lu, Zhao Hong Chen, Yu Hsiung Su, Jen Chieh Yeh, Yi Fan Chen, Shih Che Lin

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

With the growing demand of multiprocessor system-on-chip (MPSoC) and 3D IC technology evolution, it is crucial to address power and thermal issues during system architecture design. Electronic system level (ESL) design is an acknowledged effective methodology to explore system design by virtual platforms. However, and to our best knowledge, current ESL virtual platforms only consider the performance and power issues. Therefore, we propose a run-time system thermal analysis framework for applications to an ESL virtual platform in order to analyze the thermal issue at an abstract level. In the experiment, the average estimation error of temperature was 3.18%, while the maximal estimation error was only 6.36% for ANSYS ICEPAK. The framework thus can help system designers explore power and thermal management at the early stages of IC development.

Original languageEnglish
Title of host publicationISOCC 2013 - 2013 International SoC Design Conference
PublisherIEEE Computer Society
Pages394-397
Number of pages4
ISBN (Print)9781479911417
DOIs
Publication statusPublished - 2013 Jan 1
Event2013 International SoC Design Conference, ISOCC 2013 - Busan, Korea, Republic of
Duration: 2013 Nov 172013 Nov 19

Publication series

NameISOCC 2013 - 2013 International SoC Design Conference

Other

Other2013 International SoC Design Conference, ISOCC 2013
CountryKorea, Republic of
CityBusan
Period13-11-1713-11-19

All Science Journal Classification (ASJC) codes

  • Hardware and Architecture
  • Electrical and Electronic Engineering

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