System thermal analysis of 3D IC on ESL virtual platform

Lih Yih Chiou; Liang Ying Lu; Zhao Hong Chen; Yu Hsiung Su; Jen Chieh Yeh; Yi Fan Chen; Shih Che Lin

doi:10.1109/ISOCC.2013.6864060

System thermal analysis of 3D IC on ESL virtual platform

Lih Yih Chiou, Liang Ying Lu, Zhao Hong Chen, Yu Hsiung Su, Jen Chieh Yeh, Yi Fan Chen, Shih Che Lin

Department of Electrical Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

1 Citation (Scopus)

Abstract

With the growing demand of multiprocessor system-on-chip (MPSoC) and 3D IC technology evolution, it is crucial to address power and thermal issues during system architecture design. Electronic system level (ESL) design is an acknowledged effective methodology to explore system design by virtual platforms. However, and to our best knowledge, current ESL virtual platforms only consider the performance and power issues. Therefore, we propose a run-time system thermal analysis framework for applications to an ESL virtual platform in order to analyze the thermal issue at an abstract level. In the experiment, the average estimation error of temperature was 3.18%, while the maximal estimation error was only 6.36% for ANSYS ICEPAK. The framework thus can help system designers explore power and thermal management at the early stages of IC development.

Original language	English
Title of host publication	ISOCC 2013 - 2013 International SoC Design Conference
Publisher	IEEE Computer Society
Pages	394-397
Number of pages	4
ISBN (Print)	9781479911417
DOIs	https://doi.org/10.1109/ISOCC.2013.6864060
Publication status	Published - 2013 Jan 1
Event	2013 International SoC Design Conference, ISOCC 2013 - Busan, Korea, Republic of Duration: 2013 Nov 17 → 2013 Nov 19

Publication series

Name	ISOCC 2013 - 2013 International SoC Design Conference

Other

Other	2013 International SoC Design Conference, ISOCC 2013
Country	Korea, Republic of
City	Busan
Period	13-11-17 → 13-11-19

All Science Journal Classification (ASJC) codes

Hardware and Architecture
Electrical and Electronic Engineering

Access to Document

10.1109/ISOCC.2013.6864060

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Cite this

@inproceedings{f85a7cd6b9ae43eda3490e8245b8c1fa,

title = "System thermal analysis of 3D IC on ESL virtual platform",

abstract = "With the growing demand of multiprocessor system-on-chip (MPSoC) and 3D IC technology evolution, it is crucial to address power and thermal issues during system architecture design. Electronic system level (ESL) design is an acknowledged effective methodology to explore system design by virtual platforms. However, and to our best knowledge, current ESL virtual platforms only consider the performance and power issues. Therefore, we propose a run-time system thermal analysis framework for applications to an ESL virtual platform in order to analyze the thermal issue at an abstract level. In the experiment, the average estimation error of temperature was 3.18%, while the maximal estimation error was only 6.36% for ANSYS ICEPAK. The framework thus can help system designers explore power and thermal management at the early stages of IC development.",

author = "Chiou, {Lih Yih} and Lu, {Liang Ying} and Chen, {Zhao Hong} and Su, {Yu Hsiung} and Yeh, {Jen Chieh} and Chen, {Yi Fan} and Lin, {Shih Che}",

year = "2013",

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doi = "10.1109/ISOCC.2013.6864060",

language = "English",

isbn = "9781479911417",

series = "ISOCC 2013 - 2013 International SoC Design Conference",

publisher = "IEEE Computer Society",

pages = "394--397",

booktitle = "ISOCC 2013 - 2013 International SoC Design Conference",

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note = "2013 International SoC Design Conference, ISOCC 2013 ; Conference date: 17-11-2013 Through 19-11-2013",

}

Chiou, LY, Lu, LY, Chen, ZH, Su, YH, Yeh, JC, Chen, YF & Lin, SC 2013, System thermal analysis of 3D IC on ESL virtual platform. in ISOCC 2013 - 2013 International SoC Design Conference., 6864060, ISOCC 2013 - 2013 International SoC Design Conference, IEEE Computer Society, pp. 394-397, 2013 International SoC Design Conference, ISOCC 2013, Busan, Korea, Republic of, 13-11-17. https://doi.org/10.1109/ISOCC.2013.6864060

System thermal analysis of 3D IC on ESL virtual platform. / Chiou, Lih Yih; Lu, Liang Ying; Chen, Zhao Hong; Su, Yu Hsiung; Yeh, Jen Chieh; Chen, Yi Fan; Lin, Shih Che.

ISOCC 2013 - 2013 International SoC Design Conference. IEEE Computer Society, 2013. p. 394-397 6864060 (ISOCC 2013 - 2013 International SoC Design Conference).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

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AU - Yeh, Jen Chieh

AU - Chen, Yi Fan

AU - Lin, Shih Che

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