The amorphous interphase formed in an intermetallic-free Cu/Sn couple during early stage electromigration

Chien Lung Liang; Kwang Lung Lin

doi:10.1016/j.scriptamat.2018.06.024

The amorphous interphase formed in an intermetallic-free Cu/Sn couple during early stage electromigration

Chien Lung Liang, Kwang Lung Lin

Research output: Contribution to journal › Article › peer-review

7 Citations (Scopus)

Abstract

The early stage athermal electromigration behavior at the heterogeneous interface of a Cu/Sn couple was investigated at room temperature. The material interaction formed an interphase consisting of an amorphous Cu-Sn matrix, enriched with Cu (87.6–93.4 at.% Cu) and embedded with a few nano-crystalline Cu cells. The Cu-rich characteristic of the interphase indicates atypical interdiffusion behavior. The formation of the interphase was governed by the electrodisruption of the cathode Cu lattices accompanying the interdiffusion between Cu and Sn atoms. The occurrence of the meta-stable interphase is believed to be a preliminary stage prior to the subsequent intermetallic formation.

Original language	English
Pages (from-to)	58-62
Number of pages	5
Journal	Scripta Materialia
Volume	155
DOIs	https://doi.org/10.1016/j.scriptamat.2018.06.024
Publication status	Published - 2018 Oct

All Science Journal Classification (ASJC) codes

Materials Science(all)
Condensed Matter Physics
Mechanics of Materials
Mechanical Engineering
Metals and Alloys

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title = "The amorphous interphase formed in an intermetallic-free Cu/Sn couple during early stage electromigration",

abstract = "The early stage athermal electromigration behavior at the heterogeneous interface of a Cu/Sn couple was investigated at room temperature. The material interaction formed an interphase consisting of an amorphous Cu-Sn matrix, enriched with Cu (87.6–93.4 at.% Cu) and embedded with a few nano-crystalline Cu cells. The Cu-rich characteristic of the interphase indicates atypical interdiffusion behavior. The formation of the interphase was governed by the electrodisruption of the cathode Cu lattices accompanying the interdiffusion between Cu and Sn atoms. The occurrence of the meta-stable interphase is believed to be a preliminary stage prior to the subsequent intermetallic formation.",

author = "Liang, {Chien Lung} and Lin, {Kwang Lung}",

note = "Funding Information: The authors gratefully acknowledge the financial support for the present study from the Ministry of Science and Technology of the Republic of China under MOST104-2221-E-006-028-MY3 . Publisher Copyright: {\textcopyright} 2018 Elsevier Ltd",

year = "2018",

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doi = "10.1016/j.scriptamat.2018.06.024",

language = "English",

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T1 - The amorphous interphase formed in an intermetallic-free Cu/Sn couple during early stage electromigration

AU - Liang, Chien Lung

AU - Lin, Kwang Lung

N1 - Funding Information: The authors gratefully acknowledge the financial support for the present study from the Ministry of Science and Technology of the Republic of China under MOST104-2221-E-006-028-MY3 . Publisher Copyright: © 2018 Elsevier Ltd

PY - 2018/10

Y1 - 2018/10

N2 - The early stage athermal electromigration behavior at the heterogeneous interface of a Cu/Sn couple was investigated at room temperature. The material interaction formed an interphase consisting of an amorphous Cu-Sn matrix, enriched with Cu (87.6–93.4 at.% Cu) and embedded with a few nano-crystalline Cu cells. The Cu-rich characteristic of the interphase indicates atypical interdiffusion behavior. The formation of the interphase was governed by the electrodisruption of the cathode Cu lattices accompanying the interdiffusion between Cu and Sn atoms. The occurrence of the meta-stable interphase is believed to be a preliminary stage prior to the subsequent intermetallic formation.

AB - The early stage athermal electromigration behavior at the heterogeneous interface of a Cu/Sn couple was investigated at room temperature. The material interaction formed an interphase consisting of an amorphous Cu-Sn matrix, enriched with Cu (87.6–93.4 at.% Cu) and embedded with a few nano-crystalline Cu cells. The Cu-rich characteristic of the interphase indicates atypical interdiffusion behavior. The formation of the interphase was governed by the electrodisruption of the cathode Cu lattices accompanying the interdiffusion between Cu and Sn atoms. The occurrence of the meta-stable interphase is believed to be a preliminary stage prior to the subsequent intermetallic formation.

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JF - Scripta Materialia

SN - 1359-6462

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The amorphous interphase formed in an intermetallic-free Cu/Sn couple during early stage electromigration

Abstract

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