The application of carbon black and printing ink technology in molded interconnect devices

Ren Hao Liu, Wen-Bin Young

Research output: Contribution to journalArticle

3 Citations (Scopus)

Abstract

In this article, the processing of molded interconnect devices (MIDs) was studied via in-mold decoration (IMD) molding technology. A screen printing process using carbon black and printing ink was proposed in the study. For comparison, various conductivity materials such as copper powder, iron powder, carbon black and silver composite were studied with the screen printing method. The results show that there is no electrical conductivity for the ink containing copper or iron powder up to 90% concentration. The low cost carbon black with printing ink was shown to be successful for the IMD process.

Original languageEnglish
Pages (from-to)395-403
Number of pages9
JournalJournal of Polymer Engineering
Volume34
Issue number5
DOIs
Publication statusPublished - 2014 Jul 1

Fingerprint

Soot
Carbon black
Ink
Copper powder
Iron powder
Screen printing
Silver
Molding
Composite materials
Processing
Costs

All Science Journal Classification (ASJC) codes

  • Chemical Engineering(all)
  • Polymers and Plastics
  • Materials Chemistry

Cite this

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The application of carbon black and printing ink technology in molded interconnect devices. / Liu, Ren Hao; Young, Wen-Bin.

In: Journal of Polymer Engineering, Vol. 34, No. 5, 01.07.2014, p. 395-403.

Research output: Contribution to journalArticle

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