TY - JOUR
T1 - The application of carbon black and printing ink technology in molded interconnect devices
AU - Liu, Ren Hao
AU - Young, Wen Bin
N1 - Publisher Copyright:
Copyright © 2011-2014 by Walter de Gruyter GmbH.
PY - 2014/7/1
Y1 - 2014/7/1
N2 - In this article, the processing of molded interconnect devices (MIDs) was studied via in-mold decoration (IMD) molding technology. A screen printing process using carbon black and printing ink was proposed in the study. For comparison, various conductivity materials such as copper powder, iron powder, carbon black and silver composite were studied with the screen printing method. The results show that there is no electrical conductivity for the ink containing copper or iron powder up to 90% concentration. The low cost carbon black with printing ink was shown to be successful for the IMD process.
AB - In this article, the processing of molded interconnect devices (MIDs) was studied via in-mold decoration (IMD) molding technology. A screen printing process using carbon black and printing ink was proposed in the study. For comparison, various conductivity materials such as copper powder, iron powder, carbon black and silver composite were studied with the screen printing method. The results show that there is no electrical conductivity for the ink containing copper or iron powder up to 90% concentration. The low cost carbon black with printing ink was shown to be successful for the IMD process.
UR - http://www.scopus.com/inward/record.url?scp=84908545961&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84908545961&partnerID=8YFLogxK
U2 - 10.1515/polyeng-2013-0292
DO - 10.1515/polyeng-2013-0292
M3 - Article
AN - SCOPUS:84908545961
SN - 0334-6447
VL - 34
SP - 395
EP - 403
JO - Journal of Polymer Engineering
JF - Journal of Polymer Engineering
IS - 5
ER -