The Blech effect revisited - an in-situ study

Shih Kang Lin, Yu Chen Liu, Kuan Hsueh Lin

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Blech critical product (BCP) is the product of the metal strip length times its current density passing through, and has served as the threshold for electromigration occurrence. The validity of BCP is still under debates. In this study, we employed in situ synchrotron radiation-based X-ray diffraction, ex situ scanning electron microscopic and transmission electron microscopic analyses to revisit BCP for aluminum strip. We proposed a new mechanism based on electric current-dislocation interaction and stress relaxation to revisit the BCP mechanism. The abnormal microstructures from microscopic analysis support the perspective where a series of complicated defect dynamics process involved in stress relaxation including recovery, recrystallization and grain growth.

Original languageEnglish
Title of host publication2022 International Conference on Electronics Packaging, ICEP 2022
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages205-206
Number of pages2
ISBN (Electronic)9784991191138
DOIs
Publication statusPublished - 2022
Event21st International Conference on Electronics Packaging, ICEP 2022 - Sapporo, Japan
Duration: 2022 May 112022 May 14

Publication series

Name2022 International Conference on Electronics Packaging, ICEP 2022

Conference

Conference21st International Conference on Electronics Packaging, ICEP 2022
Country/TerritoryJapan
CitySapporo
Period22-05-1122-05-14

All Science Journal Classification (ASJC) codes

  • Process Chemistry and Technology
  • Electrical and Electronic Engineering
  • Industrial and Manufacturing Engineering
  • Electronic, Optical and Magnetic Materials

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