The characteristic of abrasive particle in chemical - Mechanical polishing

H. J. Tsai, C. C. Chang, Y. R. Jeng, S. L. Chen

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

Chemical Mechanical Polishing (CMP) is the key technique for wafer global planarization. However, the characteristic of abrasive particle, including particle size and grain/grain collision elasticity, plays an important role in CMP process. This investigation analyzes the slurry flow between the wafer and pad using a grain flow model with partial hydrodynamic lubrication theory. This model predicts the film thickness and remove rate of the slurry flow under a variety of the CMP parameters including load, rotation speed, pad roughness, grain/grain collision elasticity and grain size. The theoretical results compare well with the previous experiment data. This study elucidates the grain characteristics during CMP process. It also contributes to the understanding of abrasive particle effects in the chemical mechanical polishing mechanism.

Original languageEnglish
Title of host publicationProgress on Advanced Manufacture for Micro/Nano Technology 2005 - Proceedings of the 2005 International Conference on Advanced Manufacture
PublisherTrans Tech Publications Ltd
Pages805-810
Number of pages6
EditionPART 2
ISBN (Print)0878499903, 9780878499908
DOIs
Publication statusPublished - 2006 Jan 1
Event2005 International Conference on Advanced Manufacture, ICAM2005 - Taipei, R.O.C., Taiwan
Duration: 2005 Nov 282005 Dec 2

Publication series

NameMaterials Science Forum
NumberPART 2
Volume505-507
ISSN (Print)0255-5476
ISSN (Electronic)1662-9752

Other

Other2005 International Conference on Advanced Manufacture, ICAM2005
CountryTaiwan
CityTaipei, R.O.C.
Period05-11-2805-12-02

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

Fingerprint Dive into the research topics of 'The characteristic of abrasive particle in chemical - Mechanical polishing'. Together they form a unique fingerprint.

Cite this