The corrosion performance of Cu alloy wire bond on Al pad in molding compounds of various chlorine contents under biased-HAST

Ying Ta Chiu, Tzu Hsing Chiang, Yin Fa Chen, Ping Feng Yang, Louie Huang, Kwang-Lung Lin

Research output: Chapter in Book/Report/Conference proceedingConference contribution

5 Citations (Scopus)

Abstract

The present article investigated the performance and interfacial behavior between Cu wire bond and Al pad under molding compounds of different chlorine contents. The epoxy molding compounds (EMCs) were categorized as ultra-high chlorine, high chlorine and low chlorine, respectively, with 24, 7.6, and 4.3 ppm chlorine contents. The ball bonds were stressed under 130°C/85%RH with biased voltage of 10V. The interfacial evolution between Cu wire bond and Al pad was investigated in EMC of three chlorine contents after the biased-HAST test. The Cu bonding wires used in the plastic ball grid array (PBGA) package include bare Cu wire (4N Cu) and Pd coated Cu alloy wire (98Cu2Pd). The as bonded wire bond exhibits an average Cu-Al DV1C thickness of ∼0.12 um in both types of Cu wire. Two Cu-Al IMC layers, Cu9Al4 and CuAl2, analyzed by EDX were formed after 100h of biased-HAST test. The joint failed in 192h and 1296h, respectively, under ultra-high and high chlorine content EMC. The joint lasts longer than 2000h with low chlorine content EMC. The corrosion of IMC formed between Cu wire and Al pad, occurs in the ultra-high and high chlorine molding compound. The results of EDX analysis indicate that the chlorine ion diffuses from molding compound to DVIC through the crack formed between IMC and Al pad. Al2O3 was formed within the DVIC layer. It is believed the existence of Al2O3 accelerates the penetration of the chlorine ion and thus the corrosion.

Original languageEnglish
Title of host publicationProceedings - Electronic Components and Technology Conference
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages419-424
Number of pages6
ISBN (Electronic)9781479924073
DOIs
Publication statusPublished - 2014 Sep 11
Event64th Electronic Components and Technology Conference, ECTC 2014 - Orlando, United States
Duration: 2014 May 272014 May 30

Publication series

NameProceedings - Electronic Components and Technology Conference
ISSN (Print)0569-5503

Other

Other64th Electronic Components and Technology Conference, ECTC 2014
CountryUnited States
CityOrlando
Period14-05-2714-05-30

Fingerprint

Chlorine Compounds
Sheet molding compounds
Chlorine
Wire
Corrosion
Energy dispersive spectroscopy
Ions
Ball grid arrays

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

Cite this

Chiu, Y. T., Chiang, T. H., Chen, Y. F., Yang, P. F., Huang, L., & Lin, K-L. (2014). The corrosion performance of Cu alloy wire bond on Al pad in molding compounds of various chlorine contents under biased-HAST. In Proceedings - Electronic Components and Technology Conference (pp. 419-424). [6897319] (Proceedings - Electronic Components and Technology Conference). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ECTC.2014.6897319
Chiu, Ying Ta ; Chiang, Tzu Hsing ; Chen, Yin Fa ; Yang, Ping Feng ; Huang, Louie ; Lin, Kwang-Lung. / The corrosion performance of Cu alloy wire bond on Al pad in molding compounds of various chlorine contents under biased-HAST. Proceedings - Electronic Components and Technology Conference. Institute of Electrical and Electronics Engineers Inc., 2014. pp. 419-424 (Proceedings - Electronic Components and Technology Conference).
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abstract = "The present article investigated the performance and interfacial behavior between Cu wire bond and Al pad under molding compounds of different chlorine contents. The epoxy molding compounds (EMCs) were categorized as ultra-high chlorine, high chlorine and low chlorine, respectively, with 24, 7.6, and 4.3 ppm chlorine contents. The ball bonds were stressed under 130°C/85{\%}RH with biased voltage of 10V. The interfacial evolution between Cu wire bond and Al pad was investigated in EMC of three chlorine contents after the biased-HAST test. The Cu bonding wires used in the plastic ball grid array (PBGA) package include bare Cu wire (4N Cu) and Pd coated Cu alloy wire (98Cu2Pd). The as bonded wire bond exhibits an average Cu-Al DV1C thickness of ∼0.12 um in both types of Cu wire. Two Cu-Al IMC layers, Cu9Al4 and CuAl2, analyzed by EDX were formed after 100h of biased-HAST test. The joint failed in 192h and 1296h, respectively, under ultra-high and high chlorine content EMC. The joint lasts longer than 2000h with low chlorine content EMC. The corrosion of IMC formed between Cu wire and Al pad, occurs in the ultra-high and high chlorine molding compound. The results of EDX analysis indicate that the chlorine ion diffuses from molding compound to DVIC through the crack formed between IMC and Al pad. Al2O3 was formed within the DVIC layer. It is believed the existence of Al2O3 accelerates the penetration of the chlorine ion and thus the corrosion.",
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Chiu, YT, Chiang, TH, Chen, YF, Yang, PF, Huang, L & Lin, K-L 2014, The corrosion performance of Cu alloy wire bond on Al pad in molding compounds of various chlorine contents under biased-HAST. in Proceedings - Electronic Components and Technology Conference., 6897319, Proceedings - Electronic Components and Technology Conference, Institute of Electrical and Electronics Engineers Inc., pp. 419-424, 64th Electronic Components and Technology Conference, ECTC 2014, Orlando, United States, 14-05-27. https://doi.org/10.1109/ECTC.2014.6897319

The corrosion performance of Cu alloy wire bond on Al pad in molding compounds of various chlorine contents under biased-HAST. / Chiu, Ying Ta; Chiang, Tzu Hsing; Chen, Yin Fa; Yang, Ping Feng; Huang, Louie; Lin, Kwang-Lung.

Proceedings - Electronic Components and Technology Conference. Institute of Electrical and Electronics Engineers Inc., 2014. p. 419-424 6897319 (Proceedings - Electronic Components and Technology Conference).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

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N2 - The present article investigated the performance and interfacial behavior between Cu wire bond and Al pad under molding compounds of different chlorine contents. The epoxy molding compounds (EMCs) were categorized as ultra-high chlorine, high chlorine and low chlorine, respectively, with 24, 7.6, and 4.3 ppm chlorine contents. The ball bonds were stressed under 130°C/85%RH with biased voltage of 10V. The interfacial evolution between Cu wire bond and Al pad was investigated in EMC of three chlorine contents after the biased-HAST test. The Cu bonding wires used in the plastic ball grid array (PBGA) package include bare Cu wire (4N Cu) and Pd coated Cu alloy wire (98Cu2Pd). The as bonded wire bond exhibits an average Cu-Al DV1C thickness of ∼0.12 um in both types of Cu wire. Two Cu-Al IMC layers, Cu9Al4 and CuAl2, analyzed by EDX were formed after 100h of biased-HAST test. The joint failed in 192h and 1296h, respectively, under ultra-high and high chlorine content EMC. The joint lasts longer than 2000h with low chlorine content EMC. The corrosion of IMC formed between Cu wire and Al pad, occurs in the ultra-high and high chlorine molding compound. The results of EDX analysis indicate that the chlorine ion diffuses from molding compound to DVIC through the crack formed between IMC and Al pad. Al2O3 was formed within the DVIC layer. It is believed the existence of Al2O3 accelerates the penetration of the chlorine ion and thus the corrosion.

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Chiu YT, Chiang TH, Chen YF, Yang PF, Huang L, Lin K-L. The corrosion performance of Cu alloy wire bond on Al pad in molding compounds of various chlorine contents under biased-HAST. In Proceedings - Electronic Components and Technology Conference. Institute of Electrical and Electronics Engineers Inc. 2014. p. 419-424. 6897319. (Proceedings - Electronic Components and Technology Conference). https://doi.org/10.1109/ECTC.2014.6897319