The development of a new contact type piezoresistive micro-shear-stress sensor

M. C. Hsieh, Y. K. Fang, M. S. Ju, J. J. Ho, S. F. Ting

Research output: Contribution to journalConference articlepeer-review

7 Citations (Scopus)

Abstract

A prototype contact type micro piezoresistive shear-stress sensor that can be utilized to measure the shear stress between skin of stump and socket of Above-Knee (AK) prosthesis was designed, fabricated and tested. Micro-electro-mechanical system (MEMS) technology has been chosen for the design because of the low cost, small size and adaptability to this application. In this paper, the Finite Element Method (FEM) package ANSYS has been employed for the stress analysis of the micro shear-stress sensors. The sensors contain two X-ducers that will transform the stresses into an output voltage. In the developed sensor, a 3000×3000×300 μm3 square membrane is formed by bulk micromaching of an n-type 〈100〉 monolithic silicon. The piezoresistive strain gauges were implanted with boron ions with a dose of 1015 atoms/cm2. Static characteristics of the shear sensor were determined through a series of calibration tests. The fabricated sensor exhibits a sensitivity of 0.13 mV/mA-MPa for a 1.4 N full scales shear force range and the overall mean hysteresis error is than 3.5%. In addition, the results simulated by FEM are validated by comparison with experimental investigations.

Original languageEnglish
Pages (from-to)285-295
Number of pages11
JournalProceedings of SPIE - The International Society for Optical Engineering
Volume4755
DOIs
Publication statusPublished - 2002 Jan 1
EventDesign, Test, Integration, and packaging of MEMS/MOEMS 2002 - Cannes, France
Duration: 2002 May 62002 May 8

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering

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