The early stage dissolution of Ni and the nucleation of Ni-Sn intermetallic compound at the interface during the soldering of Sn-3.5Ag on a Ni substrate

Yu Wei Lin, Kwang Lung Lin

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14 Citations (Scopus)

Abstract

The early stage soldering reaction, reflow for 5 s at 250 °C followed by a liquid nitrogen quench, of Sn-3.5Ag on an electroplated Ni substrate gives rise to a Ni dissolution zone, an amorphous Ni-Sn diffusion zone, and nuclei of NiSn intermetallic compound within the interfacial region. The nucleation of NiSn takes place at the interface between the dissolution zone and the amorphous diffusion zone as well as within the amorphous Ni-Sn diffusion zone, producing 10 nm nanocrystallites. High resolution transmission electron microscope observations indicate that NiSn is the preliminary intermetallic compound that forms during the soldering reaction.

Original languageEnglish
Article number063536
JournalJournal of Applied Physics
Volume108
Issue number6
DOIs
Publication statusPublished - 2010 Sep 15

All Science Journal Classification (ASJC) codes

  • Physics and Astronomy(all)

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