The effect of contact angle and solder bump arrangement on underfill process

Wen Bin Young

doi:10.1109/ICEPT.2006.359734

The effect of contact angle and solder bump arrangement on underfill process

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

This study was devoted to investigate the effects of the contact angle and the bump arrangement on the underfill flow. The Hele-Shaw flow model, that considered the flow resistance in both the thickness direction between the chip and substrate and the plane direction between solder bumps, was assumed. A modified capillary force model including the effects of the contact angle and the bump arrangement was proposed. The capillary force was formulated based on either quadrilateral or hexagonal bump arrangements. A hexagonal arrangement of solder bumps was studied.

Original language	English
Title of host publication	2006 7th International Conference on Electronics Packaging Technology, ICEPT '06
DOIs	https://doi.org/10.1109/ICEPT.2006.359734
Publication status	Published - 2007
Event	2006 7th International Conference on Electronics Packaging Technology, ICEPT '06 - Shanghai, China Duration: 2006 Aug 26 → 2006 Aug 29

Publication series

Name	2006 7th International Conference on Electronics Packaging Technology, ICEPT '06

Other

Other	2006 7th International Conference on Electronics Packaging Technology, ICEPT '06
Country/Territory	China
City	Shanghai
Period	06-08-26 → 06-08-29

All Science Journal Classification (ASJC) codes

Electrical and Electronic Engineering
Electronic, Optical and Magnetic Materials
Condensed Matter Physics

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10.1109/ICEPT.2006.359734

Cite this

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title = "The effect of contact angle and solder bump arrangement on underfill process",

abstract = "This study was devoted to investigate the effects of the contact angle and the bump arrangement on the underfill flow. The Hele-Shaw flow model, that considered the flow resistance in both the thickness direction between the chip and substrate and the plane direction between solder bumps, was assumed. A modified capillary force model including the effects of the contact angle and the bump arrangement was proposed. The capillary force was formulated based on either quadrilateral or hexagonal bump arrangements. A hexagonal arrangement of solder bumps was studied.",

author = "Young, {Wen Bin}",

year = "2007",

doi = "10.1109/ICEPT.2006.359734",

language = "English",

isbn = "142440620X",

series = "2006 7th International Conference on Electronics Packaging Technology, ICEPT '06",

booktitle = "2006 7th International Conference on Electronics Packaging Technology, ICEPT '06",

note = "2006 7th International Conference on Electronics Packaging Technology, ICEPT '06 ; Conference date: 26-08-2006 Through 29-08-2006",

}

Young, WB 2007, The effect of contact angle and solder bump arrangement on underfill process. in 2006 7th International Conference on Electronics Packaging Technology, ICEPT '06., 4198855, 2006 7th International Conference on Electronics Packaging Technology, ICEPT '06, 2006 7th International Conference on Electronics Packaging Technology, ICEPT '06, Shanghai, China, 06-08-26. https://doi.org/10.1109/ICEPT.2006.359734

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T1 - The effect of contact angle and solder bump arrangement on underfill process

AU - Young, Wen Bin

PY - 2007

Y1 - 2007

N2 - This study was devoted to investigate the effects of the contact angle and the bump arrangement on the underfill flow. The Hele-Shaw flow model, that considered the flow resistance in both the thickness direction between the chip and substrate and the plane direction between solder bumps, was assumed. A modified capillary force model including the effects of the contact angle and the bump arrangement was proposed. The capillary force was formulated based on either quadrilateral or hexagonal bump arrangements. A hexagonal arrangement of solder bumps was studied.

AB - This study was devoted to investigate the effects of the contact angle and the bump arrangement on the underfill flow. The Hele-Shaw flow model, that considered the flow resistance in both the thickness direction between the chip and substrate and the plane direction between solder bumps, was assumed. A modified capillary force model including the effects of the contact angle and the bump arrangement was proposed. The capillary force was formulated based on either quadrilateral or hexagonal bump arrangements. A hexagonal arrangement of solder bumps was studied.

UR - http://www.scopus.com/inward/record.url?scp=35148813486&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=35148813486&partnerID=8YFLogxK

U2 - 10.1109/ICEPT.2006.359734

DO - 10.1109/ICEPT.2006.359734

M3 - Conference contribution

AN - SCOPUS:35148813486

SN - 142440620X

SN - 9781424406203

T3 - 2006 7th International Conference on Electronics Packaging Technology, ICEPT '06

BT - 2006 7th International Conference on Electronics Packaging Technology, ICEPT '06

T2 - 2006 7th International Conference on Electronics Packaging Technology, ICEPT '06

Y2 - 26 August 2006 through 29 August 2006

ER -

The effect of contact angle and solder bump arrangement on underfill process

Abstract

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All Science Journal Classification (ASJC) codes

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