The effect of contact angle and solder bump arrangement on underfill process

Wen-Bin Young

doi:10.1109/ICEPT.2006.359734

The effect of contact angle and solder bump arrangement on underfill process

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

This study was devoted to investigate the effects of the contact angle and the bump arrangement on the underfill flow. The Hele-Shaw flow model, that considered the flow resistance in both the thickness direction between the chip and substrate and the plane direction between solder bumps, was assumed. A modified capillary force model including the effects of the contact angle and the bump arrangement was proposed. The capillary force was formulated based on either quadrilateral or hexagonal bump arrangements. A hexagonal arrangement of solder bumps was studied.

Original language	English
Title of host publication	2006 7th International Conference on Electronics Packaging Technology, ICEPT '06
DOIs	https://doi.org/10.1109/ICEPT.2006.359734
Publication status	Published - 2007 Oct 12
Event	2006 7th International Conference on Electronics Packaging Technology, ICEPT '06 - Shanghai, China Duration: 2006 Aug 26 → 2006 Aug 29

Publication series

Name	2006 7th International Conference on Electronics Packaging Technology, ICEPT '06

Other

Other	2006 7th International Conference on Electronics Packaging Technology, ICEPT '06
Country	China
City	Shanghai
Period	06-08-26 → 06-08-29

All Science Journal Classification (ASJC) codes

Electrical and Electronic Engineering
Electronic, Optical and Magnetic Materials
Condensed Matter Physics

Access to Document

10.1109/ICEPT.2006.359734

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Cite this

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title = "The effect of contact angle and solder bump arrangement on underfill process",

abstract = "This study was devoted to investigate the effects of the contact angle and the bump arrangement on the underfill flow. The Hele-Shaw flow model, that considered the flow resistance in both the thickness direction between the chip and substrate and the plane direction between solder bumps, was assumed. A modified capillary force model including the effects of the contact angle and the bump arrangement was proposed. The capillary force was formulated based on either quadrilateral or hexagonal bump arrangements. A hexagonal arrangement of solder bumps was studied.",

author = "Wen-Bin Young",

year = "2007",

month = oct,

day = "12",

doi = "10.1109/ICEPT.2006.359734",

language = "English",

isbn = "142440620X",

series = "2006 7th International Conference on Electronics Packaging Technology, ICEPT '06",

booktitle = "2006 7th International Conference on Electronics Packaging Technology, ICEPT '06",

note = "2006 7th International Conference on Electronics Packaging Technology, ICEPT '06 ; Conference date: 26-08-2006 Through 29-08-2006",

}

Young, W-B 2007, The effect of contact angle and solder bump arrangement on underfill process. in 2006 7th International Conference on Electronics Packaging Technology, ICEPT '06., 4198855, 2006 7th International Conference on Electronics Packaging Technology, ICEPT '06, 2006 7th International Conference on Electronics Packaging Technology, ICEPT '06, Shanghai, China, 06-08-26. https://doi.org/10.1109/ICEPT.2006.359734

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AU - Young, Wen-Bin

PY - 2007/10/12

Y1 - 2007/10/12

N2 - This study was devoted to investigate the effects of the contact angle and the bump arrangement on the underfill flow. The Hele-Shaw flow model, that considered the flow resistance in both the thickness direction between the chip and substrate and the plane direction between solder bumps, was assumed. A modified capillary force model including the effects of the contact angle and the bump arrangement was proposed. The capillary force was formulated based on either quadrilateral or hexagonal bump arrangements. A hexagonal arrangement of solder bumps was studied.

AB - This study was devoted to investigate the effects of the contact angle and the bump arrangement on the underfill flow. The Hele-Shaw flow model, that considered the flow resistance in both the thickness direction between the chip and substrate and the plane direction between solder bumps, was assumed. A modified capillary force model including the effects of the contact angle and the bump arrangement was proposed. The capillary force was formulated based on either quadrilateral or hexagonal bump arrangements. A hexagonal arrangement of solder bumps was studied.

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M3 - Conference contribution

AN - SCOPUS:35148813486

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SN - 9781424406203

T3 - 2006 7th International Conference on Electronics Packaging Technology, ICEPT '06

BT - 2006 7th International Conference on Electronics Packaging Technology, ICEPT '06

T2 - 2006 7th International Conference on Electronics Packaging Technology, ICEPT '06

Y2 - 26 August 2006 through 29 August 2006

ER -