TY - GEN
T1 - The effect of contact angle and solder bump arrangement on underfill process
AU - Young, Wen-Bin
PY - 2007/10/12
Y1 - 2007/10/12
N2 - This study was devoted to investigate the effects of the contact angle and the bump arrangement on the underfill flow. The Hele-Shaw flow model, that considered the flow resistance in both the thickness direction between the chip and substrate and the plane direction between solder bumps, was assumed. A modified capillary force model including the effects of the contact angle and the bump arrangement was proposed. The capillary force was formulated based on either quadrilateral or hexagonal bump arrangements. A hexagonal arrangement of solder bumps was studied.
AB - This study was devoted to investigate the effects of the contact angle and the bump arrangement on the underfill flow. The Hele-Shaw flow model, that considered the flow resistance in both the thickness direction between the chip and substrate and the plane direction between solder bumps, was assumed. A modified capillary force model including the effects of the contact angle and the bump arrangement was proposed. The capillary force was formulated based on either quadrilateral or hexagonal bump arrangements. A hexagonal arrangement of solder bumps was studied.
UR - http://www.scopus.com/inward/record.url?scp=35148813486&partnerID=8YFLogxK
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U2 - 10.1109/ICEPT.2006.359734
DO - 10.1109/ICEPT.2006.359734
M3 - Conference contribution
AN - SCOPUS:35148813486
SN - 142440620X
SN - 9781424406203
T3 - 2006 7th International Conference on Electronics Packaging Technology, ICEPT '06
BT - 2006 7th International Conference on Electronics Packaging Technology, ICEPT '06
T2 - 2006 7th International Conference on Electronics Packaging Technology, ICEPT '06
Y2 - 26 August 2006 through 29 August 2006
ER -