The effect of contact angle and solder bump arrangement on underfill process

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This study was devoted to investigate the effects of the contact angle and the bump arrangement on the underfill flow. The Hele-Shaw flow model, that considered the flow resistance in both the thickness direction between the chip and substrate and the plane direction between solder bumps, was assumed. A modified capillary force model including the effects of the contact angle and the bump arrangement was proposed. The capillary force was formulated based on either quadrilateral or hexagonal bump arrangements. A hexagonal arrangement of solder bumps was studied.

Original languageEnglish
Title of host publication2006 7th International Conference on Electronics Packaging Technology, ICEPT '06
DOIs
Publication statusPublished - 2007 Oct 12
Event2006 7th International Conference on Electronics Packaging Technology, ICEPT '06 - Shanghai, China
Duration: 2006 Aug 262006 Aug 29

Publication series

Name2006 7th International Conference on Electronics Packaging Technology, ICEPT '06

Other

Other2006 7th International Conference on Electronics Packaging Technology, ICEPT '06
CountryChina
CityShanghai
Period06-08-2606-08-29

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics

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