The effect of contact angle and solder bump arrangement on underfill process

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This study was devoted to investigate the effects of the contact angle and the bump arrangement on the underfill flow. The Hele-Shaw flow model, that considered the flow resistance in both the thickness direction between the chip and substrate and the plane direction between solder bumps, was assumed. A modified capillary force model including the effects of the contact angle and the bump arrangement was proposed. The capillary force was formulated based on either quadrilateral or hexagonal bump arrangements. A hexagonal arrangement of solder bumps was studied.

Original languageEnglish
Title of host publication2006 7th International Conference on Electronics Packaging Technology, ICEPT '06
DOIs
Publication statusPublished - 2007
Event2006 7th International Conference on Electronics Packaging Technology, ICEPT '06 - Shanghai, China
Duration: 2006 Aug 262006 Aug 29

Publication series

Name2006 7th International Conference on Electronics Packaging Technology, ICEPT '06

Other

Other2006 7th International Conference on Electronics Packaging Technology, ICEPT '06
Country/TerritoryChina
CityShanghai
Period06-08-2606-08-29

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics

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