The effect of electrical current on tensile properties and vibration characteristics of Sn-9Zn-1Cu lead-free solder

Fei Yi Hung; Truan Sheng Lui; Li Hui Chen; Ji Ge You

doi:10.2320/matertrans.47.2935

The effect of electrical current on tensile properties and vibration characteristics of Sn-9Zn-1Cu lead-free solder

Fei Yi Hung, Truan Sheng Lui, Li Hui Chen, Ji Ge You

Research output: Contribution to journal › Article › peer-review

5 Citations (Scopus)

Abstract

The effect of electrical current on the microstructure, the tensile properties and vibration deformation mechanisms of the Sn-9Zn-1 Cu leadfree solder were examined in this study. Results showed that Zn-rich phase, Sn-Zn eutectic, Cu₅Zn₈ intermetallic compounds and proeutectic Sn-rich phase existed in the matrix of a Sn-9Zn-1Cu specimen. An electrical current flowing for a short duration was able to improve the tensile strength of the solder alloy. But prolonging the duration more than 7 hours led to a deterioration in the tensile mechanical properties and vibration resistance. Under both constant force and initial-deflection conditions, the electrical current caused the vibration life of the specimens to deteriorate. Lamellar-deformed structures (LDS) decreased and Cu₅Zn₈ fractured easily, which in turn decreased the crack propagation resistance.

Original language	English
Pages (from-to)	2935-2941
Number of pages	7
Journal	Materials Transactions
Volume	47
Issue number	12
DOIs	https://doi.org/10.2320/matertrans.47.2935
Publication status	Published - 2006 Dec

All Science Journal Classification (ASJC) codes

General Materials Science
Condensed Matter Physics
Mechanics of Materials
Mechanical Engineering

Access to Document

10.2320/matertrans.47.2935

Cite this

@article{939ef68b6246480a8d2e7fc406e7113f,

title = "The effect of electrical current on tensile properties and vibration characteristics of Sn-9Zn-1Cu lead-free solder",

abstract = "The effect of electrical current on the microstructure, the tensile properties and vibration deformation mechanisms of the Sn-9Zn-1 Cu leadfree solder were examined in this study. Results showed that Zn-rich phase, Sn-Zn eutectic, Cu5Zn8 intermetallic compounds and proeutectic Sn-rich phase existed in the matrix of a Sn-9Zn-1Cu specimen. An electrical current flowing for a short duration was able to improve the tensile strength of the solder alloy. But prolonging the duration more than 7 hours led to a deterioration in the tensile mechanical properties and vibration resistance. Under both constant force and initial-deflection conditions, the electrical current caused the vibration life of the specimens to deteriorate. Lamellar-deformed structures (LDS) decreased and Cu5Zn8 fractured easily, which in turn decreased the crack propagation resistance.",

author = "Hung, {Fei Yi} and Lui, {Truan Sheng} and Chen, {Li Hui} and You, {Ji Ge}",

year = "2006",

month = dec,

doi = "10.2320/matertrans.47.2935",

language = "English",

volume = "47",

pages = "2935--2941",

journal = "Materials Transactions",

issn = "1345-9678",

publisher = "Japan Institute of Metals (JIM)",

number = "12",

}

TY - JOUR

T1 - The effect of electrical current on tensile properties and vibration characteristics of Sn-9Zn-1Cu lead-free solder

AU - Hung, Fei Yi

AU - Lui, Truan Sheng

AU - Chen, Li Hui

AU - You, Ji Ge

PY - 2006/12

Y1 - 2006/12

N2 - The effect of electrical current on the microstructure, the tensile properties and vibration deformation mechanisms of the Sn-9Zn-1 Cu leadfree solder were examined in this study. Results showed that Zn-rich phase, Sn-Zn eutectic, Cu5Zn8 intermetallic compounds and proeutectic Sn-rich phase existed in the matrix of a Sn-9Zn-1Cu specimen. An electrical current flowing for a short duration was able to improve the tensile strength of the solder alloy. But prolonging the duration more than 7 hours led to a deterioration in the tensile mechanical properties and vibration resistance. Under both constant force and initial-deflection conditions, the electrical current caused the vibration life of the specimens to deteriorate. Lamellar-deformed structures (LDS) decreased and Cu5Zn8 fractured easily, which in turn decreased the crack propagation resistance.

AB - The effect of electrical current on the microstructure, the tensile properties and vibration deformation mechanisms of the Sn-9Zn-1 Cu leadfree solder were examined in this study. Results showed that Zn-rich phase, Sn-Zn eutectic, Cu5Zn8 intermetallic compounds and proeutectic Sn-rich phase existed in the matrix of a Sn-9Zn-1Cu specimen. An electrical current flowing for a short duration was able to improve the tensile strength of the solder alloy. But prolonging the duration more than 7 hours led to a deterioration in the tensile mechanical properties and vibration resistance. Under both constant force and initial-deflection conditions, the electrical current caused the vibration life of the specimens to deteriorate. Lamellar-deformed structures (LDS) decreased and Cu5Zn8 fractured easily, which in turn decreased the crack propagation resistance.

UR - http://www.scopus.com/inward/record.url?scp=33847293895&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=33847293895&partnerID=8YFLogxK

U2 - 10.2320/matertrans.47.2935

DO - 10.2320/matertrans.47.2935

M3 - Article

AN - SCOPUS:33847293895

SN - 1345-9678

VL - 47

SP - 2935

EP - 2941

JO - Materials Transactions

JF - Materials Transactions

IS - 12

ER -

The effect of electrical current on tensile properties and vibration characteristics of Sn-9Zn-1Cu lead-free solder

Abstract

All Science Journal Classification (ASJC) codes

Access to Document

Other files and links

Fingerprint

Cite this