The effect of electrical current on tensile properties and vibration characteristics of Sn-9Zn-1Cu lead-free solder

Fei Yi Hung, Truan Sheng Lui, Li Hui Chen, Ji Ge You

Research output: Contribution to journalArticlepeer-review

4 Citations (Scopus)

Abstract

The effect of electrical current on the microstructure, the tensile properties and vibration deformation mechanisms of the Sn-9Zn-1 Cu leadfree solder were examined in this study. Results showed that Zn-rich phase, Sn-Zn eutectic, Cu5Zn8 intermetallic compounds and proeutectic Sn-rich phase existed in the matrix of a Sn-9Zn-1Cu specimen. An electrical current flowing for a short duration was able to improve the tensile strength of the solder alloy. But prolonging the duration more than 7 hours led to a deterioration in the tensile mechanical properties and vibration resistance. Under both constant force and initial-deflection conditions, the electrical current caused the vibration life of the specimens to deteriorate. Lamellar-deformed structures (LDS) decreased and Cu5Zn8 fractured easily, which in turn decreased the crack propagation resistance.

Original languageEnglish
Pages (from-to)2935-2941
Number of pages7
JournalMaterials Transactions
Volume47
Issue number12
DOIs
Publication statusPublished - 2006 Dec

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

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