The effect of Ga content on the wetting reaction and interfacial morphology formed between Sn-8.55Zn-0.5Ag-0.1Al-xGa solders and Cu

Nai Shuo Liu, Kwang Lung Lin

Research output: Contribution to journalArticlepeer-review

67 Citations (Scopus)

Abstract

The wetting properties of Sn-8.5Zn-0.5Ag-0.1Al-xGa lead-free solders were investigated. The wetting time and wetting angle decreased while the wetting force increased with the increase in Ga content. The intermetallic compounds were Al4.2Cu3.2Zn0.7, Cu5Zn 8, Cu5Zn8 and AgZn3 in the solder. The activation energy and the surface tension of the solder were estimated.

Original languageEnglish
Pages (from-to)219-224
Number of pages6
JournalScripta Materialia
Volume54
Issue number2
DOIs
Publication statusPublished - 2006 Jan 1

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering
  • Metals and Alloys

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