The effect of Ga content on the wetting reaction and interfacial morphology formed between Sn-8.55Zn-0.5Ag-0.1Al-xGa solders and Cu

Nai Shuo Liu; Kwang Lung Lin

doi:10.1016/j.scriptamat.2005.09.033

The effect of Ga content on the wetting reaction and interfacial morphology formed between Sn-8.55Zn-0.5Ag-0.1Al-xGa solders and Cu

Nai Shuo Liu, Kwang Lung Lin

Research output: Contribution to journal › Article › peer-review

67 Citations (Scopus)

Abstract

The wetting properties of Sn-8.5Zn-0.5Ag-0.1Al-xGa lead-free solders were investigated. The wetting time and wetting angle decreased while the wetting force increased with the increase in Ga content. The intermetallic compounds were Al_4.2Cu_3.2Zn_0.7, Cu₅Zn ₈, Cu₅Zn₈ and AgZn₃ in the solder. The activation energy and the surface tension of the solder were estimated.

Original language	English
Pages (from-to)	219-224
Number of pages	6
Journal	Scripta Materialia
Volume	54
Issue number	2
DOIs	https://doi.org/10.1016/j.scriptamat.2005.09.033
Publication status	Published - 2006 Jan 1

All Science Journal Classification (ASJC) codes

Materials Science(all)
Condensed Matter Physics
Mechanics of Materials
Mechanical Engineering
Metals and Alloys

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10.1016/j.scriptamat.2005.09.033

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@article{0a86ca86099349b695f21cb899498d60,

title = "The effect of Ga content on the wetting reaction and interfacial morphology formed between Sn-8.55Zn-0.5Ag-0.1Al-xGa solders and Cu",

abstract = "The wetting properties of Sn-8.5Zn-0.5Ag-0.1Al-xGa lead-free solders were investigated. The wetting time and wetting angle decreased while the wetting force increased with the increase in Ga content. The intermetallic compounds were Al4.2Cu3.2Zn0.7, Cu5Zn 8, Cu5Zn8 and AgZn3 in the solder. The activation energy and the surface tension of the solder were estimated.",

author = "Liu, {Nai Shuo} and Lin, {Kwang Lung}",

year = "2006",

month = jan,

day = "1",

doi = "10.1016/j.scriptamat.2005.09.033",

language = "English",

volume = "54",

pages = "219--224",

journal = "Scripta Materialia",

issn = "1359-6462",

publisher = "Elsevier Limited",

number = "2",

}

TY - JOUR

T1 - The effect of Ga content on the wetting reaction and interfacial morphology formed between Sn-8.55Zn-0.5Ag-0.1Al-xGa solders and Cu

AU - Liu, Nai Shuo

AU - Lin, Kwang Lung

PY - 2006/1/1

Y1 - 2006/1/1

N2 - The wetting properties of Sn-8.5Zn-0.5Ag-0.1Al-xGa lead-free solders were investigated. The wetting time and wetting angle decreased while the wetting force increased with the increase in Ga content. The intermetallic compounds were Al4.2Cu3.2Zn0.7, Cu5Zn 8, Cu5Zn8 and AgZn3 in the solder. The activation energy and the surface tension of the solder were estimated.

AB - The wetting properties of Sn-8.5Zn-0.5Ag-0.1Al-xGa lead-free solders were investigated. The wetting time and wetting angle decreased while the wetting force increased with the increase in Ga content. The intermetallic compounds were Al4.2Cu3.2Zn0.7, Cu5Zn 8, Cu5Zn8 and AgZn3 in the solder. The activation energy and the surface tension of the solder were estimated.

UR - http://www.scopus.com/inward/record.url?scp=27644553870&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=27644553870&partnerID=8YFLogxK

U2 - 10.1016/j.scriptamat.2005.09.033

DO - 10.1016/j.scriptamat.2005.09.033

M3 - Article

AN - SCOPUS:27644553870

VL - 54

SP - 219

EP - 224

JO - Scripta Materialia

JF - Scripta Materialia

SN - 1359-6462

IS - 2

ER -