TY - JOUR
T1 - The effect of saccharin addition on the mechanical properties and fracture behavior of electroless Ni-Cu-P deposit on Al
AU - Hsu, Jen Che
AU - Lin, Kwang Lung
N1 - Funding Information:
The authors acknowledge the National Science Council of the Republic of China for the financial support of this study under NSC89-2216-E-006-088.
PY - 2005/1/3
Y1 - 2005/1/3
N2 - In a previous study, the effects of additive saccharin on internal stress, diffusion, and crystallization behaviors of electroless Ni-Cu-P deposits on Al were examined. In this study, tensile test results and microhardness measurements were used to investigate the effect of additive saccharin on the mechanical properties and fracture behavior of electroless Ni-Cu-P deposits on Al. An increase in the saccharin content of the plating solution from 0 to 12 g/L results in nodule growth and void elimination in the deposits. The denser nodules in the deposit also cause a decrease in the tensile stress and reveal the effect of ATCE on compressive stress generation. Consequently, the mechanical properties of Ni-Cu-P/Al deposits in terms of microhardness, yield strength, modulus of elasticity, and ultimate tensile strength were improved. The fracture behavior of the deposit changes from transnodular to internodular when the saccharin addition is above 4 g/L.
AB - In a previous study, the effects of additive saccharin on internal stress, diffusion, and crystallization behaviors of electroless Ni-Cu-P deposits on Al were examined. In this study, tensile test results and microhardness measurements were used to investigate the effect of additive saccharin on the mechanical properties and fracture behavior of electroless Ni-Cu-P deposits on Al. An increase in the saccharin content of the plating solution from 0 to 12 g/L results in nodule growth and void elimination in the deposits. The denser nodules in the deposit also cause a decrease in the tensile stress and reveal the effect of ATCE on compressive stress generation. Consequently, the mechanical properties of Ni-Cu-P/Al deposits in terms of microhardness, yield strength, modulus of elasticity, and ultimate tensile strength were improved. The fracture behavior of the deposit changes from transnodular to internodular when the saccharin addition is above 4 g/L.
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U2 - 10.1016/j.tsf.2004.08.025
DO - 10.1016/j.tsf.2004.08.025
M3 - Article
AN - SCOPUS:10644292712
SN - 0040-6090
VL - 471
SP - 186
EP - 193
JO - Thin Solid Films
JF - Thin Solid Films
IS - 1-2
ER -