The effects of Cu alloying on the microstructure and mechanical properties of Zn-25Sn-xCu (x = 0–1.0 wt%) high temperature Pb-free solders

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Abstract

The effects of Cu alloying on the microstructure and mechanical properties of Zn-25Sn-xCu (x = 0–1.0 wt%) high temperature Pb-free solders were investigated in the present study. The 1 wt% Cu alloying enhanced the ultimate tensile strength and the micro-hardness of the primary η-Zn phase by 23.1% and 144.0% increments, respectively. These mechanical property variations were attributed to the combined effects of grain refining strengthening of the primary η-Zn phases, precipitation strengthening of the fine ε-CuZn 5 compounds in the η-Zn matrix (Cu content greater than 0.3 wt%), and solid-solution strengthening of the Cu inclusion in the η-Zn matrix. The granular two-phase (η-Zn + ε-CuZn 5 ) microstructure, composed of refined η-Zn matrix and fine ε-CuZn 5 precipitations, contributed to superior mechanical strength of the Zn-25Sn-xCu high temperature Pb-free solders.

Original languageEnglish
Pages (from-to)117-124
Number of pages8
JournalMaterials Science and Engineering A
Volume750
DOIs
Publication statusPublished - 2019 Mar 18

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

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