The electromigration investigation on the newly developed Pb-free Sn-Zn-Ag-Al-Ga solder ball interconnect

Kwang Lung Lin, Ger Pin Lin

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

A Sn-Zn based eutectic solder with a relatively lower melting temperature and cost was under investigation for its response to electrical current stressing. The BGA (ball grid array) joint was produced with the Sn-8.5Zn-0.5Ag-0.01Al-0.1Ga solder ball. The solder joint was supplied from industry and was produced to interconnect PCB and BGA substrate on which the metallization layers are Cu (30-35 um)/Ni (10 urn)/Au (0.2-1 urn). The investigation was conducted under air at 120°C in a furnace with a current density in the order of 10-3 A/cm2. Voids were found in th solder near the metallization of the PCB side when the electron flows outward the PCB. Meanwhile, the IMC (AuZn3 and AgZ3) formed on the substrate side during reflow was decomposed after current stressing. The decomposition results in the reformation of Zn-Ag-Zu IMC within the solder. Delta-NiZn compound was also detected within the solder, of which the Ni may come from the Cu/Ni/Au metallization layer. The Ni was also found to form NiGa compound within the solder. Hillocks were found for the IMC layer regardless of the direction of electrical current.

Original languageEnglish
Title of host publicationProceedings - 57th Electronic Components and Technology Conference 2007, ECTC '07
Pages1467-1471
Number of pages5
DOIs
Publication statusPublished - 2007 Oct 22
Event57th Electronic Components and Technology Conference 2007, ECTC '07 - Sparks, NV, United States
Duration: 2007 May 292007 Jun 1

Publication series

NameProceedings - Electronic Components and Technology Conference
ISSN (Print)0569-5503

Other

Other57th Electronic Components and Technology Conference 2007, ECTC '07
CountryUnited States
CitySparks, NV
Period07-05-2907-06-01

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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  • Cite this

    Lin, K. L., & Lin, G. P. (2007). The electromigration investigation on the newly developed Pb-free Sn-Zn-Ag-Al-Ga solder ball interconnect. In Proceedings - 57th Electronic Components and Technology Conference 2007, ECTC '07 (pp. 1467-1471). [4250075] (Proceedings - Electronic Components and Technology Conference). https://doi.org/10.1109/ECTC.2007.373989