The failure mode of Bi and Ni-doped Sn-Ag-Cu solder joint under electromigration tests

T. C. Lin, H. Y. Kung, S. H. Lee, M. H. Chen, Y. T. Chiu, K. L. Lin

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

The effects of minor alloying additions of Ni and Bi on the electromigration (EM) reliability and nanomechanical properties of Sn-Ag-Cu (SAC405 and SAC1205, noted as SAC) solder joints were investigated. The nanomechanical properties of the solders were measured by nanoindentation with the continuous contact stiffness (CSM) mode. The EM results indicated that the SAC-Ni solders exhibit better lifetime than others. The EM fracture behaviors of the solder joints were governed by the intermetallic compounds formed in the solder joints. The fracture occurred at the redistribution layer and under bump metallization/solder ball interface for SAC-Bi and SAC-Ni, respectively. Both the nanohardness and the elastic modulus of SAC solders are clearly enhanced by the minor alloying additions of Ni and Bi.

Original languageEnglish
Title of host publication2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2018
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages226-229
Number of pages4
ISBN (Electronic)9784990218850
DOIs
Publication statusPublished - 2018 Jun 6
Event2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2018 - Kuwana, Mie, Japan
Duration: 2018 Apr 172018 Apr 21

Publication series

Name2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2018

Other

Other2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2018
CountryJapan
CityKuwana, Mie
Period18-04-1718-04-21

Fingerprint

Electromigration
Soldering alloys
Failure modes
Alloying
Nanohardness
Nanoindentation
Metallizing
Intermetallics
Elastic moduli
Stiffness

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials
  • Polymers and Plastics

Cite this

Lin, T. C., Kung, H. Y., Lee, S. H., Chen, M. H., Chiu, Y. T., & Lin, K. L. (2018). The failure mode of Bi and Ni-doped Sn-Ag-Cu solder joint under electromigration tests. In 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2018 (pp. 226-229). (2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2018). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.23919/ICEP.2018.8374708
Lin, T. C. ; Kung, H. Y. ; Lee, S. H. ; Chen, M. H. ; Chiu, Y. T. ; Lin, K. L. / The failure mode of Bi and Ni-doped Sn-Ag-Cu solder joint under electromigration tests. 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2018. Institute of Electrical and Electronics Engineers Inc., 2018. pp. 226-229 (2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2018).
@inproceedings{acbaa66320de4e3a8261025cdeb823d0,
title = "The failure mode of Bi and Ni-doped Sn-Ag-Cu solder joint under electromigration tests",
abstract = "The effects of minor alloying additions of Ni and Bi on the electromigration (EM) reliability and nanomechanical properties of Sn-Ag-Cu (SAC405 and SAC1205, noted as SAC) solder joints were investigated. The nanomechanical properties of the solders were measured by nanoindentation with the continuous contact stiffness (CSM) mode. The EM results indicated that the SAC-Ni solders exhibit better lifetime than others. The EM fracture behaviors of the solder joints were governed by the intermetallic compounds formed in the solder joints. The fracture occurred at the redistribution layer and under bump metallization/solder ball interface for SAC-Bi and SAC-Ni, respectively. Both the nanohardness and the elastic modulus of SAC solders are clearly enhanced by the minor alloying additions of Ni and Bi.",
author = "Lin, {T. C.} and Kung, {H. Y.} and Lee, {S. H.} and Chen, {M. H.} and Chiu, {Y. T.} and Lin, {K. L.}",
year = "2018",
month = "6",
day = "6",
doi = "10.23919/ICEP.2018.8374708",
language = "English",
series = "2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2018",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "226--229",
booktitle = "2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2018",
address = "United States",

}

Lin, TC, Kung, HY, Lee, SH, Chen, MH, Chiu, YT & Lin, KL 2018, The failure mode of Bi and Ni-doped Sn-Ag-Cu solder joint under electromigration tests. in 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2018. 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2018, Institute of Electrical and Electronics Engineers Inc., pp. 226-229, 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2018, Kuwana, Mie, Japan, 18-04-17. https://doi.org/10.23919/ICEP.2018.8374708

The failure mode of Bi and Ni-doped Sn-Ag-Cu solder joint under electromigration tests. / Lin, T. C.; Kung, H. Y.; Lee, S. H.; Chen, M. H.; Chiu, Y. T.; Lin, K. L.

2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2018. Institute of Electrical and Electronics Engineers Inc., 2018. p. 226-229 (2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2018).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

TY - GEN

T1 - The failure mode of Bi and Ni-doped Sn-Ag-Cu solder joint under electromigration tests

AU - Lin, T. C.

AU - Kung, H. Y.

AU - Lee, S. H.

AU - Chen, M. H.

AU - Chiu, Y. T.

AU - Lin, K. L.

PY - 2018/6/6

Y1 - 2018/6/6

N2 - The effects of minor alloying additions of Ni and Bi on the electromigration (EM) reliability and nanomechanical properties of Sn-Ag-Cu (SAC405 and SAC1205, noted as SAC) solder joints were investigated. The nanomechanical properties of the solders were measured by nanoindentation with the continuous contact stiffness (CSM) mode. The EM results indicated that the SAC-Ni solders exhibit better lifetime than others. The EM fracture behaviors of the solder joints were governed by the intermetallic compounds formed in the solder joints. The fracture occurred at the redistribution layer and under bump metallization/solder ball interface for SAC-Bi and SAC-Ni, respectively. Both the nanohardness and the elastic modulus of SAC solders are clearly enhanced by the minor alloying additions of Ni and Bi.

AB - The effects of minor alloying additions of Ni and Bi on the electromigration (EM) reliability and nanomechanical properties of Sn-Ag-Cu (SAC405 and SAC1205, noted as SAC) solder joints were investigated. The nanomechanical properties of the solders were measured by nanoindentation with the continuous contact stiffness (CSM) mode. The EM results indicated that the SAC-Ni solders exhibit better lifetime than others. The EM fracture behaviors of the solder joints were governed by the intermetallic compounds formed in the solder joints. The fracture occurred at the redistribution layer and under bump metallization/solder ball interface for SAC-Bi and SAC-Ni, respectively. Both the nanohardness and the elastic modulus of SAC solders are clearly enhanced by the minor alloying additions of Ni and Bi.

UR - http://www.scopus.com/inward/record.url?scp=85048758032&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=85048758032&partnerID=8YFLogxK

U2 - 10.23919/ICEP.2018.8374708

DO - 10.23919/ICEP.2018.8374708

M3 - Conference contribution

AN - SCOPUS:85048758032

T3 - 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2018

SP - 226

EP - 229

BT - 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2018

PB - Institute of Electrical and Electronics Engineers Inc.

ER -

Lin TC, Kung HY, Lee SH, Chen MH, Chiu YT, Lin KL. The failure mode of Bi and Ni-doped Sn-Ag-Cu solder joint under electromigration tests. In 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2018. Institute of Electrical and Electronics Engineers Inc. 2018. p. 226-229. (2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2018). https://doi.org/10.23919/ICEP.2018.8374708