The failure mode of Bi and Ni-doped Sn-Ag-Cu solder joint under electromigration tests

T. C. Lin, H. Y. Kung, S. H. Lee, M. H. Chen, Y. T. Chiu, K. L. Lin

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

The effects of minor alloying additions of Ni and Bi on the electromigration (EM) reliability and nanomechanical properties of Sn-Ag-Cu (SAC405 and SAC1205, noted as SAC) solder joints were investigated. The nanomechanical properties of the solders were measured by nanoindentation with the continuous contact stiffness (CSM) mode. The EM results indicated that the SAC-Ni solders exhibit better lifetime than others. The EM fracture behaviors of the solder joints were governed by the intermetallic compounds formed in the solder joints. The fracture occurred at the redistribution layer and under bump metallization/solder ball interface for SAC-Bi and SAC-Ni, respectively. Both the nanohardness and the elastic modulus of SAC solders are clearly enhanced by the minor alloying additions of Ni and Bi.

Original languageEnglish
Title of host publication2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2018
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages226-229
Number of pages4
ISBN (Electronic)9784990218850
DOIs
Publication statusPublished - 2018 Jun 6
Event2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2018 - Kuwana, Mie, Japan
Duration: 2018 Apr 172018 Apr 21

Publication series

Name2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2018

Other

Other2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2018
CountryJapan
CityKuwana, Mie
Period18-04-1718-04-21

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials
  • Polymers and Plastics

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